Inventor · disambiguated record
Shouhong Tang
Also filed as: TANG SHOUHONG
24 granted patents·3 pending applications·275 citations·filing 1992–2016
96Inventor score
Files withKLA TENCOR CORP13PHASE SHIFT TECHNOLOGY INC4TANG SHOUHONG4KLA TENCOR TECH CORP2CHEN HAIGUANG1
Top patents by PatentIndex Score
27 records- 0194US6847458B2Method and apparatus for measuring the shape and thickness variation of polished opaque platesPHASE SHIFT TECHNOLOGY INC·Filed 2003·Granted Jan 25, 2005·81 cites·10 claims
- 0292US9121684B2Method for reducing wafer shape and thickness measurement errors resulted from cavity shape changesKLA TENCOR CORP·Filed 2013·Granted Sep 1, 2015·16 cites·19 claims
- 0390US9702829B1Systems and methods for wafer surface feature detection and quantificationKLA TENCOR CORP·Filed 2014·Granted Jul 11, 2017·12 cites·25 claims
- 0488US10352691B1Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry toolKLA TENCOR CORP·Filed 2014·Granted Jul 16, 2019·10 cites·22 claims
- 0586US8949057B1Method for compensating for wafer shape measurement variation due to variation of environment temperatureSEONG KIBYUNG·Filed 2011·Granted Feb 3, 2015·17 cites·8 claims
- 0684US7408649B2Method and apparatus for optically analyzing a surfaceKLA TENCOR TECH CORP·Filed 2005·Granted Aug 5, 2008·11 cites·43 claims
- 0783US8068234B2Method and apparatus for measuring shape or thickness information of a substrateTANG SHOUHONG·Filed 2009·Granted Nov 29, 2011·15 cites·58 claims
- 0882US8537369B1Method and apparatus for measuring the shape and thickness variation of a wafer by two single-shot phase-shifting interferometersTANG SHOUHONG·Filed 2010·Granted Sep 17, 2013·7 cites·17 claims
- 0982US5471307ASheet flatness measurement system and methodPHASE SHIFT TECHNOLOGY INC·Filed 1992·Granted Nov 28, 1995·50 cites·19 claims
- 1081US7847954B2Measuring the shape and thickness variation of a wafer with high slopesKLA TENCOR CORP·Filed 2008·Granted Dec 7, 2010·13 cites·24 claims
- 1173US7428056B2Method and apparatus for optically analyzing a surfaceKLA TENCOR TECH CORP·Filed 2006·Granted Sep 23, 2008·6 cites·17 claims
- 1271US7583386B2Method and apparatus for optically analyzing a surfaceKLA TENCOR CORP·Filed 2008·Granted Sep 1, 2009·5 cites·30 claims
- 1369US9074873B1Measurement of thickness variation and shape of wafersKLA TENCOR CORP·Filed 2013·Granted Jul 7, 2015·2 cites·20 claims
- 1469US7538887B1Temporal interferometric signal modeling with constant phase shift in white light interferometryKLA TENCOR CORP·Filed 2006·Granted May 26, 2009·6 cites·15 claims
- 1566US9163928B2Reducing registration error of front and back wafer surfaces utilizing a see-through calibration waferKLA TENCOR CORP·Filed 2013·Granted Oct 20, 2015·3 cites·18 claims
- 1663US8630479B2Methods and systems for improved localized feature quantification in surface metrology toolsCHEN HAIGUANG·Filed 2011·Granted Jan 14, 2014·2 cites·19 claims
- 1759US7667852B2Measuring the shape, thickness variation, and material inhomogeneity of a waferKLA TENCOR CORP·Filed 2008·Granted Feb 23, 2010·3 cites·10 claims
- 1857US6856405B2Non linear phase shift calibration for interferometric measurement of multiple surfacesPHASE SHIFT TECHNOLOGY INC·Filed 2003·Granted Feb 15, 2005·8 cites·7 claims
- 1955US7595891B2Measurement of the top surface of an object with/without transparent thin films in white light interferometryKLA TENCOR CORP·Filed 2005·Granted Sep 29, 2009·2 cites·6 claims
- 2054US8621945B2Method and apparatus for improving the temperature stability and minimizing the noise of the environment that encloses an interferometric measuring systemZENG AN ANDREW·Filed 2011·Granted Jan 7, 2014·2 cites·10 claims
- 2150US9903708B2Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrateKLA TENCOR CORP·Filed 2016·Granted Feb 27, 2018·0 cites·20 claims
- 2248US6885461B2Weighted least-square interferometric measurement of multiple surfacesPHASE SHIFT TECHNOLOGY INC·Filed 2002·Granted Apr 26, 2005·4 cites·26 claims
- 2346US9279663B2Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrateWANG CHUNHAI·Filed 2012·Granted Mar 8, 2016·0 cites·20 claims
- 2445US2014293291A1Wafer Shape and Thickness Measurement System Utilizing Shearing InterferometersKLA TENCOR CORP·Filed 2014·Application pending·0 cites
- 2541US9019491B2Method and apparatus for measuring shape and thickness variation of a waferTANG SHOUHONG·Filed 2012·Granted Apr 28, 2015·0 cites·23 claims
- 2635US2015176973A1A dual interferometer system with a short reference flat distance for wafer shape and thickness variation measurementTANG SHOUHONG·Filed 2011·Application pending·0 cites
- 2733US2015192404A1Reducing registration error of front and back wafer surfaces utilizing a see-through calibration waferKLA TENCOR CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →