Inventor · disambiguated record
Takaaki Shiota
Also filed as: SHIOTA TAKAAKI
8 granted patents·2 pending applications·76 citations·filing 2000–2009
84Inventor score
Top patents by PatentIndex Score
10 records- 0187US6663708B1Silicon wafer, and manufacturing method and heat treatment method of the sameMITSUBISHI MATERIAL SILICON·Filed 2000·Granted Dec 16, 2003·42 cites·1 claims
- 0279US7632349B2Silicon wafer surface defect evaluation methodSUMCO CORP·Filed 2006·Granted Dec 15, 2009·8 cites·5 claims
- 0370US6428619B1Silicon wafer, and heat treatment method of the same and the heat-treated silicon waferMITSUBISHI MATERIAL SILICON·Filed 2000·Granted Aug 6, 2002·16 cites·11 claims
- 0465US6682597B2Silicon wafer, and heat treatment method of the same and the heat-treated silicon waferMITSUBISHI MATERIAL SILICON·Filed 2002·Granted Jan 27, 2004·7 cites·2 claims
- 0562US7582540B2Method for manufacturing SOI waferSUMCO CORP·Filed 2005·Granted Sep 1, 2009·2 cites·2 claims
- 0654US7615467B2Method for manufacturing SOI waferSUMCO CORP·Filed 2005·Granted Nov 10, 2009·1 cites·3 claims
- 0749US7960253B2Thin silicon wafer with high gettering ability and production method thereofSUMCO CORP·Filed 2009·Granted Jun 14, 2011·0 cites·6 claims
- 0846US2010009521A1Method of producing semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 0939US2004025983A1Method of manufacturing siliconFiled 2003·Application pending·0 cites
- 1037US7122082B2Silicon wafer and manufacturing method thereofSUMITOMO MITSUBISHI SILICON·Filed 2003·Granted Oct 17, 2006·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →