Inventor · disambiguated record
Kaoru Konno
Also filed as: KONNO KAORU
8 granted patents·2 pending applications·4 citations·filing 2008–2021
75Inventor score
Files withKONNO KAORU3SHOWA DENKO MATERIALS CO LTD3HAYASHI HIROKI1HITACHI CHEMICAL CO LTD1LG ENERGY SOLUTION LTD1
Top patents by PatentIndex Score
10 records- 0169US9247652B2Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive compositionKONNO KAORU·Filed 2008·Granted Jan 26, 2016·2 cites·9 claims
- 0262US10504864B2Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive compositionHITACHI CHEMICAL CO LTD·Filed 2015·Granted Dec 10, 2019·0 cites·12 claims
- 0358US8421247B2Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting materialHAYASHI HIROKI·Filed 2009·Granted Apr 16, 2013·2 cites·12 claims
- 0453US11411250B2Electrolytic solution and electrochemical deviceSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Aug 9, 2022·0 cites·7 claims
- 0553US11031600B2Lithium ion secondary battery including aluminum silicateLG ENERGY SOLUTION LTD·Filed 2015·Granted Jun 8, 2021·0 cites·10 claims
- 0652US11444325B2Electrolytic solution and electrochemical deviceSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Sep 13, 2022·0 cites·6 claims
- 0747US12259191B2Rotary heat exchangerUNIV TOHOKU·Filed 2021·Granted Mar 25, 2025·0 cites·9 claims
- 0846US11398643B2Electrolytic solution and electrochemical deviceSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Jul 26, 2022·0 cites·12 claims
- 0931US2013302603A1Adhesive composition and semiconductor device using sameKONNO KAORU·Filed 2012·Application pending·0 cites
- 1031US2013183535A1Adhesive composition and semiconductor device using the sameKONNO KAORU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →