Assignee
KONNO KAORU
JP·1 granted patent·2 pending applications·2 citations·filing 2008–2012
Top patents by PatentIndex Score
3 records- 0169US9247652B2Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive compositionKONNO KAORU·Filed 2008·Granted Jan 26, 2016·2 cites·9 claims
- 0231US2013302603A1Adhesive composition and semiconductor device using sameKONNO KAORU·Filed 2012·Application pending·0 cites
- 0331US2013183535A1Adhesive composition and semiconductor device using the sameKONNO KAORU·Filed 2011·Application pending·0 cites
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