Inventor · disambiguated record
Efren M. Lacap
Also filed as: LACAP EFREN · LACAP EFREN M
14 granted patents·2 pending applications·208 citations·filing 1996–2022
92Inventor score
Files withLACAP EFREN M4VOLTERRA SEMICONDUCTOR CORP4INVENSENSE INC2JERGOVIC ILIJA2TEXAS INSTRUMENTS INC2
Top patents by PatentIndex Score
16 records- 0196US8106516B1Wafer-level chip scale packageLACAP EFREN M·Filed 2010·Granted Jan 31, 2012·26 cites·38 claims
- 0293US11584638B2Reducing delamination in sensor packageINVENSENSE INC·Filed 2020·Granted Feb 21, 2023·3 cites·19 claims
- 0393US8169081B1Conductive routings in integrated circuits using under bump metallizationJERGOVIC ILIJA·Filed 2008·Granted May 1, 2012·33 cites·38 claims
- 0493US8085553B1Lead assembly for a flip-chip power switchLACAP EFREN M·Filed 2008·Granted Dec 27, 2011·30 cites·52 claims
- 0593US7989953B1Flip chip power switch with under bump metallization stackVOLTERRA SEMICONDUCTOR CORP·Filed 2008·Granted Aug 2, 2011·25 cites·26 claims
- 0686US8680676B1Semiconductor package with under bump metallization routingVOLTERRA SEMICONDUCTOR CORP·Filed 2013·Granted Mar 25, 2014·6 cites·15 claims
- 0777US8933520B1Conductive routings in integrated circuits using under bump metallizationVOLTERRA SEMICONDUCTOR CORP·Filed 2014·Granted Jan 13, 2015·3 cites·16 claims
- 0873US5905299AThermally enhanced thin quad flatpack packageTEXAS INSTRUMENTS INC·Filed 1997·Granted May 18, 1999·45 cites·16 claims
- 0969US8664767B2Conductive routings in integrated circuits using under bump metallizationJERGOVIC ILIJA·Filed 2012·Granted Mar 4, 2014·2 cites·12 claims
- 1064US8368212B1Semiconductor package with under bump metallization routingVOLTERRA SEMICONDUCTOR CORP·Filed 2011·Granted Feb 5, 2013·1 cites·34 claims
- 1162US5939781AThermally enhanced integrated circuit packaging systemTEXAS INSTRUMENTS INC·Filed 1996·Granted Aug 17, 1999·28 cites·13 claims
- 1255US8710664B2Wafer-level chip scale packageLACAP EFREN M·Filed 2012·Granted Apr 29, 2014·0 cites·10 claims
- 1347US8942009B2Lead assembly for a flip-chip power switchLACAP EFREN M·Filed 2011·Granted Jan 27, 2015·0 cites·27 claims
- 1443US2023089623A1Motion sensor robustness utilizing a room-temperature-volcanizing material via a solder resist damINVENSENSE INC·Filed 2022·Application pending·0 cites
- 1542US2005045697A1Wafer-level chip scale packageFiled 2003·Application pending·0 cites
- 1635US5866941AUltra thin, leadless and molded surface mount integrated circuit packageSILICON SYSTEMS INC·Filed 1996·Granted Feb 2, 1999·6 cites·3 claims
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