Assignee
JERGOVIC ILIJA
US·2 granted patents·35 citations·filing 2008–2012
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0193US8169081B1Conductive routings in integrated circuits using under bump metallizationJERGOVIC ILIJA·Filed 2008·Granted May 1, 2012·33 cites·38 claims
- 0269US8664767B2Conductive routings in integrated circuits using under bump metallizationJERGOVIC ILIJA·Filed 2012·Granted Mar 4, 2014·2 cites·12 claims
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