Inventor · disambiguated record
Wen-Chun Liu
Also filed as: LIU WEN · LIU WEN-CHUN
22 granted patents·6 pending applications·229 citations·filing 1999–2019
95Inventor score
Files withWALSIN ADVANCED ELECTRONICS9IBIS INNOTECH INC8GENENTECH INC6NAT UNIV TSING HUA3UNIV NAT TSING HUA1
Top patents by PatentIndex Score
28 records- 0197US10256180B2Package structure and manufacturing method of package structureIBIS INNOTECH INC·Filed 2017·Granted Apr 9, 2019·37 cites·21 claims
- 0284US9688965B2Recombinant neuraminidase and uses thereofNAT UNIV TSING HUA·Filed 2015·Granted Jun 27, 2017·3 cites·13 claims
- 0380US10010549B2Biheteroaryl compounds and uses thereofGENENTECH INC·Filed 2015·Granted Jul 3, 2018·2 cites·10 claims
- 0480US9365583B2Substituted pyrazoles and uses thereofGENENTECH INC·Filed 2014·Granted Jun 14, 2016·3 cites·40 claims
- 0580US6762118B2Package having array of metal pegs linked by printed circuit linesWALSIN ADVANCED ELECTRONICS·Filed 2002·Granted Jul 13, 2004·32 cites·13 claims
- 0678US9508634B2Package structureIBIS INNOTECH INC·Filed 2016·Granted Nov 29, 2016·3 cites·41 claims
- 0774US9859193B2Package structureIBIS INNOTECH INC·Filed 2017·Granted Jan 2, 2018·2 cites·25 claims
- 0873US11129832B2Biheteroaryl compounds and uses thereofGENENTECH INC·Filed 2019·Granted Sep 28, 2021·0 cites·27 claims
- 0972US9801282B2Package structureIBIS INNOTECH INC·Filed 2016·Granted Oct 24, 2017·2 cites·25 claims
- 1072US6278182B1Lead frame type semiconductor packageWALSIN ADVANCED ELECTRONICS·Filed 1999·Granted Aug 21, 2001·40 cites·15 claims
- 1171US10028942B23-substituted pyrazoles and uses thereofGENENTECH INC·Filed 2016·Granted Jul 24, 2018·1 cites·69 claims
- 1268US6380062B1Method of fabricating semiconductor package having metal peg leads and connected by trace linesWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted Apr 30, 2002·16 cites·18 claims
- 1368US6204553B1Lead frame structureWALSIN ADVANCED ELECTRONICS·Filed 1999·Granted Mar 20, 2001·40 cites·11 claims
- 1467US10134668B2Package structureIBIS INNOTECH INC·Filed 2017·Granted Nov 20, 2018·1 cites·40 claims
- 1565US10090256B2Semiconductor structureIBIS INNOTECH INC·Filed 2016·Granted Oct 2, 2018·1 cites·15 claims
- 1664US2018133219A1Biheteroaryl compounds and uses thereofGENENTECH INC·Filed 2018·Application pending·0 cites
- 1760US9451694B2Package substrate structureIBIS INNOTECH INC·Filed 2015·Granted Sep 20, 2016·1 cites·35 claims
- 1857US6078099ALead frame structure for preventing the warping of semiconductor package bodyWALSIN ADVANCED ELECTRONICS·Filed 1999·Granted Jun 20, 2000·24 cites·28 claims
- 1954US6486564B2Heat dissipation module for a BGA ICWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted Nov 26, 2002·7 cites·19 claims
- 2049US2014221628A1Influenza virus-like particles comprising adjuvant-fused m2 protein to enhance the immunogenicity of vaccineNAT UNIV TSING HUA·Filed 2014·Application pending·0 cites
- 2144US6262475B1Lead frame with heat slugWALSIN ADVANCED ELECTRONICS·Filed 1999·Granted Jul 17, 2001·11 cites·18 claims
- 2243US9644008B2Deglycosylated hemagglutinin and manufacture thereofNAT UNIV TSING HUA·Filed 2014·Granted May 9, 2017·0 cites·3 claims
- 2343US6459162B1Encapsulated semiconductor die packageWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted Oct 1, 2002·3 cites·2 claims
- 2442US9550777B23-substituted pyrazoles and use as DLK inhibitorsGENENTECH INC·Filed 2015·Granted Jan 24, 2017·0 cites·30 claims
- 2542US2017342113A1Recombinant h7 hemagglutinin and use thereofUNIV NAT TSING HUA·Filed 2016·Application pending·0 cites
- 2641US2002127976A1Built-in micro-speaker for wireless communication deviceFiled 2001·Application pending·0 cites
- 2736US2003224542A1Method for making multi-chip packages and single chip packages simultaneously and structures from thereofWALSIN ADVANCED ELECTRONICS·Filed 2002·Application pending·0 cites
- 2833US2015364448A1Package structureIBIS INNOTECH INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →