Assignee
IBIS INNOTECH INC
TW·7 granted patents·5 pending applications·47 citations·filing 2009–2017
Top patents by PatentIndex Score
12 records- 0197US10256180B2Package structure and manufacturing method of package structureIBIS INNOTECH INC·Filed 2017·Granted Apr 9, 2019·37 cites·21 claims
- 0278US9508634B2Package structureIBIS INNOTECH INC·Filed 2016·Granted Nov 29, 2016·3 cites·41 claims
- 0374US9859193B2Package structureIBIS INNOTECH INC·Filed 2017·Granted Jan 2, 2018·2 cites·25 claims
- 0472US9801282B2Package structureIBIS INNOTECH INC·Filed 2016·Granted Oct 24, 2017·2 cites·25 claims
- 0567US10134668B2Package structureIBIS INNOTECH INC·Filed 2017·Granted Nov 20, 2018·1 cites·40 claims
- 0665US10090256B2Semiconductor structureIBIS INNOTECH INC·Filed 2016·Granted Oct 2, 2018·1 cites·15 claims
- 0760US9451694B2Package substrate structureIBIS INNOTECH INC·Filed 2015·Granted Sep 20, 2016·1 cites·35 claims
- 0852US2015061814A1Ferrite circuit boardIBIS INNOTECH INC·Filed 2014·Application pending·0 cites
- 0952US2010301504A1Method of making light-guiding moduleIBIS INNOTECH INC·Filed 2009·Application pending·0 cites
- 1051US2015060929A1Ceramic circuit board and led package module using the sameIBIS INNOTECH INC·Filed 2014·Application pending·0 cites
- 1148US2016034083A1Touch sensing deviceIBIS INNOTECH INC·Filed 2014·Application pending·0 cites
- 1233US2015364448A1Package structureIBIS INNOTECH INC·Filed 2015·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →