Inventor · disambiguated record
Wei-Hsin Liu
Also filed as: LIU WEI · LIU WEI-HSIN · Liu wei-kong
24 granted patents·10 pending applications·44 citations·filing 2002–2024
93Inventor score
Files withUNITED MICROELECTRONICS CORP25YANGTZE MEMORY TECH CO LTD3APPLIED MATERIALS INC1HUANG PONG-WEY1LAI CHUNG-PING1
Top patents by PatentIndex Score
34 records- 0191US10249706B1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 2, 2019·8 cites·11 claims
- 0290US9754943B1Dynamic random access memory deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 5, 2017·8 cites·15 claims
- 0383US9589846B1Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Mar 7, 2017·6 cites·20 claims
- 0481US10643883B2Method of forming isolation structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 5, 2020·3 cites·15 claims
- 0581US9530696B1Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·4 cites·11 claims
- 0680US10340278B1Semiconductor memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 2, 2019·3 cites·17 claims
- 0779US10672864B2Manufacturing method of semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 2, 2020·2 cites·9 claims
- 0878US10276650B2Semiconductor memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 30, 2019·2 cites·10 claims
- 0976US10453677B2Method of forming oxide layerUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 22, 2019·2 cites·14 claims
- 1074US9793267B1Semiconductor device having gate structure with reduced threshold voltage and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·2 cites·16 claims
- 1171US10475900B2Method for manufacturing a semiconductor device with a cobalt silicide filmUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·1 cites·9 claims
- 1271US10262895B2Method for forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 16, 2019·1 cites·20 claims
- 1370US10535664B2Fabricating method of oxide layer within peripheral circuit regionUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 14, 2020·1 cites·13 claims
- 1465US9219151B1Method for manufacturing silicon nitride layer and method for manufacturing semiconductor structure applying the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Dec 22, 2015·1 cites·9 claims
- 1561US2024170268A1Process chamber with improved process feedbackAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1660US2025386529A1Semiconductor device and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1757US12242121B2Heat dissipation structure for optoelectronic module and electronic deviceRUIJIE NETWORKS CO LTD·Filed 2024·Granted Mar 4, 2025·0 cites·14 claims
- 1855US2024194260A1Memory device structure and fabrication methodYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 1954US9543195B1Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 10, 2017·0 cites·12 claims
- 2051US10186453B2Semiconductor structure and process thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 22, 2019·0 cites·4 claims
- 2150US10224324B2Method for manufacturing semiconductor device having gate structure with reduced threshold voltageUNITED MICROELECTRONICS CORP·Filed 2017·Granted Mar 5, 2019·0 cites·15 claims
- 2249US10903328B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 26, 2021·0 cites·4 claims
- 2348US11088023B2Method of forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 10, 2021·0 cites·14 claims
- 2448US10811272B2Method of forming stacked structure of memoryUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 20, 2020·0 cites·15 claims
- 2548US10312080B2Method for forming amorphous silicon multuple layer structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 4, 2019·0 cites·13 claims
- 2647US10475662B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·0 cites·10 claims
- 2746US2024196630A1Memory device structure and fabrication methodYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 2846US2024196631A1Memory device structure and fabrication methodYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 2944US2015206803A1Method of forming inter-level dielectric layerUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 3042US2011013339A1Assembly of magnetic capacitor with packagingLAI CHUNG PING·Filed 2009·Application pending·0 cites
- 3140US2004065618A1Purification processFiled 2002·Application pending·0 cites
- 3238US2018190662A1Bit line gate structure of dynamic random access memory (dram) and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 3338US2018361422A1Spin-on-dielectric processUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 3434US8765588B2Semiconductor processHUANG PONG-WEY·Filed 2011·Granted Jul 1, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →