Inventor · disambiguated record
Taro Fukui
Also filed as: FUKUI TARO
8 granted patents·4 pending applications·131 citations·filing 1992–2013
87Inventor score
Top patents by PatentIndex Score
12 records- 0187US7057277B2Chip package structureMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jun 6, 2006·53 cites·22 claims
- 0286US6469074B1Composition of cyanate ester, epoxy resin and acid anhydrideMATSUSHITA ELECTRIC WORKS LTD·Filed 2000·Granted Oct 22, 2002·29 cites·16 claims
- 0366US7061103B2Chip package structureMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jun 13, 2006·14 cites·16 claims
- 0463US8697237B2Thermosetting resin composition, method of manufacturing the same and circuit boardPANASONIC CORP·Filed 2013·Granted Apr 15, 2014·0 cites·8 claims
- 0559US7230331B2Chip package structure and process for fabricating the sameMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jun 12, 2007·8 cites·5 claims
- 0659US2010147567A1Thermosetting Resin Composition, Method of Manufacturing the Same and Circuit BoardPANASONIC ELEC WORKS CO LTD·Filed 2007·Application pending·0 cites
- 0756US5401812AThermosetting polyimide composition, thermoset product thereof and manufacturing process thereofMATSUSHITA ELECTRIC WORKS LTD·Filed 1992·Granted Mar 28, 1995·14 cites·9 claims
- 0846US2006261499A1Chip package structureMATSUSHITA ELECTRIC WORKS LTD·Filed 2006·Application pending·0 cites
- 0945US2007072339A1Process for fabricating chip package structureCHEN KAI-CHI·Filed 2006·Application pending·0 cites
- 1041US6120716AEpoxy resin sealing material for molding semiconductor chip and method for manufacturing the sameMATSUSHITA ELECTRIC WORKS LTD·Filed 1997·Granted Sep 19, 2000·12 cites·6 claims
- 1138US2004212080A1[chip package structure and process for fabricating the same]Filed 2004·Application pending·0 cites
- 1229US6224674B1Seal coating mask for semiconductor element and method of use thereofMATSUSHITA ELECTRIC WORKS LTD·Filed 1999·Granted May 1, 2001·1 cites·21 claims
Join the waitlist — get patent alerts
Get an alert when Taro Fukui files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →