Thermosetting Resin Composition, Method of Manufacturing the Same and Circuit Board

Abstract

The object of the invention is to provide a thermosetting resin composition which, in packaging an electronic circuit containing components incapable of withstanding elevated temperatures, employs low-melting solder particles, thereby enabling batch ref lowing and enabling packaging of components with excellent strength and toughness. The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R 1 to R 6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond π electrons and is capable of coordinating with a metal.

1 . A thermosetting resin composition comprising a metal filler component, a fluxing component and a thermosetting resin binder, wherein the metal filler component including at least one of bismuth (Bi) and indium (In) is used, and the fluxing component, which is at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used: 
     
       
         
         
             
             
         
       
       In the above formulas, R 1  to R 6  are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond π electrons and is capable of coordinating with a metal. 
     
   
   
       2 . The thermosetting resin composition of  claim 1 , which has a Bi content of from 10 to 70 wt %, based on the total weight of the metal filler component. 
   
   
       3 . The thermosetting resin composition of  claim 1 , which has an In content of from 10 to 90 wt %, based on the total weight of the metal filler component. 
   
   
       4 . The thermosetting resin composition of  claim 1 , which has a Bi content of from 10 to 70 wt % and an In content of from 10 to 90 wt %, based on the total weight of the metal filler component. 
   
   
       5 . The thermosetting resin composition of  claim 1 , wherein the metal filler component includes at least one metal selected from the group consisting of copper (Cu), silver (Ag) and nickel (Ni). 
   
   
       6 . The thermosetting resin composition of  claim 1 , wherein X in the structural formula (1) or (2) is an organic group having at least any one of structural formulas (3) to (8) below: 
     
       
         
         
             
             
         
       
       in the above formulas, R is a hydrogen or an alkyl group. 
     
   
   
       7 . The thermosetting resin composition of  claim 1 , wherein the compound of the structural formula (1) or (2) is at least one selected from the group consisting of levulinic acid, glutaric acid, succinic acid, 5-ketohexanoic acid, 3-hydroxypropionic acid, 4-aminobutyric acid, 3-mercaptopropionic acid, 3-mercaptoisobutyric acid, 3-methylthiopropionic acid, 3-phenylpropionic acid, 3-phenylisobutyric acid and 4-phenylbutyric acid. 
   
   
       8 . The thermosetting resin composition of  claim 1 , wherein an epoxy resin and a curing agent are used as the thermosetting resin binder. 
   
   
       9 . The thermosetting resin composition of  claim 1 , which includes from 3 to 50 PHR of the fluxing component, based on the thermosetting resin binder. 
   
   
       10 . The thermosetting resin composition of  claim 1 , which includes the thermosetting resin binder and the fluxing component in a total amount of from 5 to 30 wt %, based on the total weight of the composition. 
   
   
       11 . A method of producing a thermosetting resin composition, the method comprising: mixing and kneading a metal filler component which includes at least one of bismuth (Bi) and indium (In), a fluxing component composed of at least one of a compound of structural formula (1) and a compound of structural formula (2), and a liquid epoxy resin; and then adding a curing agent. 
   
   
       12 . A method of producing a thermosetting resin composition; the method comprising: mixing a metal filler component including at least one of bismuth (Bi) and indium (In), a fluxing component composed of at least one of a compound of structural formula (1) and a compound of structural formula (2), and a solvent; removing the solvent by drying; and then adding an epoxy resin and a curing agent. 
   
   
       13 . A circuit board comprising a component bonded to a substrate, using the thermosetting resin composition of a thermosetting resin composition comprising a metal filler component, a fluxing component and a thermosetting resin binder, wherein the metal filler component including at least one of bismuth (Bi) and indium (In) is used, and the fluxing component, which is at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used: 
     
       
         
         
             
             
         
       
     
     in the above formulas, R 1  to R 6  are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond π electrons and is capable of coordinating with a metal or using a thermosetting resin composition produced by the method of  claim 11 . 
   
   
       14 . The thermosetting resin composition of  claim 4 , wherein the metal filler component includes at least one metal selected from the group consisting of copper (Cu), silver (Ag) and nickel (Ni). 
   
   
       15 . The thermosetting resin composition of  claim 4 , wherein X in the structural formula (1) or (2) is an organic group having at least any one of structural formulas (3) to (8) below: 
     
       
         
         
             
             
         
       
     
     In the above formulas, R is a hydrogen or an alkyl group. 
   
   
       16 . The thermosetting resin composition of  claim 4 , wherein the compound of the structural formula (1) or (2) is at least one selected from the group consisting of levulinic acid, glutaric acid, succinic acid, 5-ketohexanoic acid, 3-hydroxypropionic acid, 4-aminobutyric acid, 3-mercaptopropionic acid, 3-mercaptoisobutyric acid, 3-methylthiopropionic acid, 3-phenylpropionic acid, 3-phenylisobutyric acid and 4-phenylbutyric acid. 
   
   
       17 . The thermosetting resin composition of  claim 4 , wherein an epoxy resin and a curing agent are used as the thermosetting resin binder. 
   
   
       18 . The thermosetting resin composition of  claim 4 , which includes from 3 to 50 PHR of the fluxing component, based on the thermosetting resin binder. 
   
   
       19 . The thermosetting resin composition of  claim 4 , which includes the thermosetting resin binder and the fluxing component in a total amount of from 5 to 30 wt %, based on the total weight of the composition. 
   
   
       20 . A circuit board comprising a component bonded to a substrate, using the thermosetting resin composition of a thermosetting resin composition comprising a metal filler component, a fluxing component and a thermosetting resin binder, wherein the metal filler component including at least one of bismuth (Bi) and indium (In) is used, and the fluxing component, which is at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used: 
     
       
         
         
             
             
         
       
     
     in the above formulas, R 1  to R 6  are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond π electrons and is capable of coordinating with a metal or using a thermosetting resin composition produced by the method of  claim 12 .