Inventor · disambiguated record
Hirohisa Hino
Also filed as: HINO HIROHISA
11 granted patents·13 pending applications·30 citations·filing 1999–2025
81Inventor score
Files withPANASONIC IP MAN CO LTD20MATSUSHITA ELECTRIC WORKS LTD2PANASONIC CORP1PANASONIC ELEC WORKS CO LTD1
Top patents by PatentIndex Score
24 records- 0186US6469074B1Composition of cyanate ester, epoxy resin and acid anhydrideMATSUSHITA ELECTRIC WORKS LTD·Filed 2000·Granted Oct 22, 2002·29 cites·16 claims
- 0271US2025121461A1Bonding material and bonded structurePANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 0371US2025282005A1Joining materialPANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 0463US8697237B2Thermosetting resin composition, method of manufacturing the same and circuit boardPANASONIC CORP·Filed 2013·Granted Apr 15, 2014·0 cites·8 claims
- 0560US2025108463A1Bonding material and bonding structurePANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 0659US2010147567A1Thermosetting Resin Composition, Method of Manufacturing the Same and Circuit BoardPANASONIC ELEC WORKS CO LTD·Filed 2007·Application pending·0 cites
- 0758US11623307B2Resin flux solder paste and mount structurePANASONIC IP MAN CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·9 claims
- 0855US2025286009A1Joining structure and joining material for forming joining part of said joining structurePANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 0953US10407604B2Heat-dissipating resin composition, and component and electronic device including the samePANASONIC IP MAN CO LTD·Filed 2015·Granted Sep 10, 2019·0 cites·16 claims
- 1053US2020306893A1Solder paste and mount structurePANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 1152US9322541B2Cooling structurePANASONIC IP MAN CO LTD·Filed 2014·Granted Apr 26, 2016·0 cites·17 claims
- 1251US12275839B2Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structurePANASONIC IP MAN CO LTD·Filed 2019·Granted Apr 15, 2025·0 cites·8 claims
- 1351US2019144701A1Heat insulating material and method for forming coating of the samePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 1446US10501628B2Resin composition, and electronic component and electronic device using samePANASONIC IP MAN CO LTD·Filed 2018·Granted Dec 10, 2019·0 cites·10 claims
- 1545US10440834B2Resin fluxed solder paste, and mount structurePANASONIC IP MAN CO LTD·Filed 2016·Granted Oct 8, 2019·0 cites·1 claims
- 1645US2020013557A1Electrolytic capacitorPANASONIC IP MAN CO LTD·Filed 2019·Application pending·0 cites
- 1744US2019177911A1Heat insulatorPANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 1843US9859190B2Resin structure, and electronic component and electronic device using the structurePANASONIC IP MAN CO LTD·Filed 2017·Granted Jan 2, 2018·0 cites·8 claims
- 1940US2019232438A1Solder paste and mount structurePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 2040US2018229333A1Solder paste and mount structure obtained by using samePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 2136US9881813B2Mounting structure and method for producing mounting structurePANASONIC IP MAN CO LTD·Filed 2016·Granted Jan 30, 2018·0 cites·6 claims
- 2235US2017120396A1Solder paste and soldering flux, and mounted structure using samePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 2331US2017338166A1Structure, and electronic component and electronic device including the structurePANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
- 2429US6224674B1Seal coating mask for semiconductor element and method of use thereofMATSUSHITA ELECTRIC WORKS LTD·Filed 1999·Granted May 1, 2001·1 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →