Inventor · disambiguated record
Toyokazu Yoshino
Also filed as: YOSHINO TOYOKAZU
10 granted patents·3 pending applications·110 citations·filing 1999–2017
87Inventor score
Top patents by PatentIndex Score
13 records- 0195US7427717B2Flexible printed wiring board and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Sep 23, 2008·52 cites·7 claims
- 0291US7263769B2Multi-layered flexible print circuit board and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Sep 4, 2007·27 cites·7 claims
- 0381US9712729B2Camera cover and cameraPANASONIC IP MAN CO LTD·Filed 2015·Granted Jul 18, 2017·3 cites·18 claims
- 0479US7543376B2Manufacturing method of flexible printed wiring boardPANASONIC CORP·Filed 2007·Granted Jun 9, 2009·11 cites·10 claims
- 0560US7367116B2Multi-layer printed circuit board, and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted May 6, 2008·8 cites·4 claims
- 0653US2013136436A1Camera cover and cameraPANASONIC CORP·Filed 2012·Application pending·0 cites
- 0750US10048572B2Camera coverPANASONIC IP MAN CO LTD·Filed 2016·Granted Aug 14, 2018·0 cites·9 claims
- 0848US2009145651A1Multilayer wiring board and method for producing the samePANASONIC CORP·Filed 2008·Application pending·0 cites
- 0944US2006272850A1Interlayer connection conductor and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 1041US10111332B1Composite cable to be connected to flat panel-shaped electrical equipmentSMK KK·Filed 2017·Granted Oct 23, 2018·0 cites·3 claims
- 1140US6383720B1Method of manufacturing fine pattern and printed circuit board manufactured with this methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted May 7, 2002·8 cites·7 claims
- 1233USD761735SElectrical connectorSMK KK·Filed 2015·Granted Jul 19, 2016·1 cites·1 claims
- 1329USD791702SElectrical connectorSMK KK·Filed 2015·Granted Jul 11, 2017·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →