Inventor · disambiguated record
Mukul Saran
Also filed as: SARAN MUKUL
15 granted patents·3 pending applications·1,149 citations·filing 1995–2009
95Inventor score
Technology areasH10W
Top patents by PatentIndex Score
18 records- 0198US5583359ACapacitor structure for an integrated circuitNORTHERN TELECOM LTD·Filed 1995·Granted Dec 10, 1996·626 cites·19 claims
- 0293US6232662B1System and method for bonding over active integrated circuitsTEXAS INSTRUMENTS INC·Filed 1999·Granted May 15, 2001·153 cites·39 claims
- 0392US6143396ASystem and method for reinforcing a bond padTEXAS INSTRUMENTS INC·Filed 1997·Granted Nov 7, 2000·130 cites·16 claims
- 0488US7727801B2Apparatus for improved power distribution in wirebond semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2009·Granted Jun 1, 2010·12 cites·3 claims
- 0588US6818540B2Fine pitch system and method for reinforcing bond pads in semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2002·Granted Nov 16, 2004·59 cites·10 claims
- 0680US6448650B1Fine pitch system and method for reinforcing bond pads in semiconductor devicesTEXAS INSTRUMENTS INC·Filed 1999·Granted Sep 10, 2002·57 cites·27 claims
- 0771US6617208B2High capacitance damascene capacitorsTEXAS INSTRUMENTS INC·Filed 2001·Granted Sep 9, 2003·17 cites·11 claims
- 0870US7338837B2Semiconductor packages for enhanced number of terminals, speed and power performanceTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 4, 2008·4 cites·3 claims
- 0966US6873040B2Semiconductor packages for enhanced number of terminals, speed and power performanceTEXAS INSTRUMENTS INC·Filed 2003·Granted Mar 29, 2005·11 cites·28 claims
- 1065US7534630B2Method of improving power distribution in wirebond semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2006·Granted May 19, 2009·2 cites·5 claims
- 1165US6625882B1System and method for reinforcing a bond padTEXAS INSTRUMENTS INC·Filed 1999·Granted Sep 30, 2003·28 cites·18 claims
- 1261US6443743B1Method for reducing via resistance in small high aspect ratio holes filled using aluminum extrusionTEXAS INSTRUMENTS INC·Filed 2000·Granted Sep 3, 2002·9 cites·8 claims
- 1361US5998296AMethod of forming contacts and vias in semiconductorTEXAS INSTRUMENTS INC·Filed 1997·Granted Dec 7, 1999·28 cites·20 claims
- 1454US7151309B2Apparatus for improved power distribution in wirebond semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2004·Granted Dec 19, 2006·4 cites·8 claims
- 1546US2006289974A1Reliable integrated circuit and packageSARAN MUKUL·Filed 2005·Application pending·0 cites
- 1643US6189209B1Method for reducing via resistance in small high aspect ratio holes filled using aluminum extrusionTEXAS INSTRUMENTS INC·Filed 1998·Granted Feb 20, 2001·9 cites·12 claims
- 1740US2004124546A1Reliable integrated circuit and packageFiled 2003·Application pending·0 cites
- 1837US2004009640A1High capacitance damascene capacitorsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →