Inventor · disambiguated record
Yuping Ren
Also filed as: REN YUPING
13 granted patents·23 citations·filing 2014–2021
86Inventor score
Top patents by PatentIndex Score
13 records- 0192US10395926B1Multiple patterning with mandrel cuts formed using a block maskGLOBALFOUNDRIES INC·Filed 2018·Granted Aug 27, 2019·11 cites·20 claims
- 0285US10319626B1Interconnects with cuts formed by block patterningGLOBALFOUNDRIES INC·Filed 2017·Granted Jun 11, 2019·4 cites·19 claims
- 0377US9666476B2Dimension-controlled via formation processingGLOBALFOUNDRIES INC·Filed 2015·Granted May 30, 2017·2 cites·19 claims
- 0475US10923388B2Gap fill void and connection structuresGLOBALFOUNDRIES INC·Filed 2019·Granted Feb 16, 2021·1 cites·18 claims
- 0572US9305832B2Dimension-controlled via formation processingGLOBALFOUNDRIES INC·Filed 2014·Granted Apr 5, 2016·2 cites·18 claims
- 0668US10002827B2Method for selective re-routing of selected areas in a target layer and in adjacent interconnecting layers of an IC deviceGLOBALFOUNDRIES INC·Filed 2017·Granted Jun 19, 2018·1 cites·9 claims
- 0768US9817927B2Hard mask etch and dielectric etch aware overlap for via and metal layersGLOBALFOUNDRIES INC·Filed 2015·Granted Nov 14, 2017·2 cites·20 claims
- 0866US11651992B2Gap fill void and connection structuresGLOBALFOUNDRIES US INC·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 0952US10770344B2Chamferless interconnect vias of semiconductor devicesGLOBALFOUNDRIES INC·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 1047US10777413B2Interconnects with non-mandrel cuts formed by early block patterningGLOBALFOUNDRIES INC·Filed 2018·Granted Sep 15, 2020·0 cites·19 claims
- 1147US9672313B2Method for selective re-routing of selected areas in a target layer and in adjacent interconnecting layers of an IC deviceGLOBALFOUNDRIES INC·Filed 2015·Granted Jun 6, 2017·0 cites·11 claims
- 1245US10600914B2Isolation pillar first gate structures and methods of forming sameGLOBALFOUNDRIES INC·Filed 2018·Granted Mar 24, 2020·0 cites·19 claims
- 1344US10566291B2Mark structure for aligning layers of integrated circuit structure and methods of forming sameGLOBALFOUNDRIES INC·Filed 2018·Granted Feb 18, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →