Inventor · disambiguated record
Richard Wise
Also filed as: WISE RICHARD · WISE RICHARD S · WISE RICHARD STEPHAN
36 granted patents·10 pending applications·772 citations·filing 1998–2025
98Inventor score
Top patents by PatentIndex Score
46 records- 0198US12278125B2Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2023·Granted Apr 15, 2025·8 cites·19 claims
- 0298US12183604B2Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2023·Granted Dec 31, 2024·9 cites·37 claims
- 0398US12094711B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2022·Granted Sep 17, 2024·5 cites·18 claims
- 0498US12051589B2Tin oxide thin film spacers in semiconductor device manufacturingLAM RES CORP·Filed 2021·Granted Jul 30, 2024·6 cites·17 claims
- 0598US11784047B2Tin oxide thin film spacers in semiconductor device manufacturingLAM RES CORP·Filed 2021·Granted Oct 10, 2023·10 cites·17 claims
- 0698US11257674B2Eliminating yield impact of stochastics in lithographyLAM RES CORP·Filed 2020·Granted Feb 22, 2022·15 cites·19 claims
- 0798US11183383B2Tin oxide thin film spacers in semiconductor device manufacturingLAM RES CORP·Filed 2020·Granted Nov 23, 2021·16 cites·18 claims
- 0898US9824893B1Tin oxide thin film spacers in semiconductor device manufacturingLAM RES CORP·Filed 2016·Granted Nov 21, 2017·442 cites·19 claims
- 0997US11031245B2Tin oxide thin film spacers in semiconductor device manufacturingLAM RES CORP·Filed 2017·Granted Jun 8, 2021·21 cites·18 claims
- 1097US10796912B2Eliminating yield impact of stochastics in lithographyLAM RES CORP·Filed 2018·Granted Oct 6, 2020·18 cites·16 claims
- 1197US10546748B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2018·Granted Jan 28, 2020·25 cites·20 claims
- 1297US10197908B2Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling frameworkLAM RES CORP·Filed 2016·Granted Feb 5, 2019·27 cites·32 claims
- 1396US12183589B2Tin oxide mandrels in patterningLAM RES CORP·Filed 2021·Granted Dec 31, 2024·3 cites·20 claims
- 1496US11322351B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2019·Granted May 3, 2022·15 cites·32 claims
- 1596US10269566B2Etching substrates using ale and selective depositionLAM RES CORP·Filed 2017·Granted Apr 23, 2019·15 cites·24 claims
- 1695US11355353B2Tin oxide mandrels in patterningLAM RES CORP·Filed 2019·Granted Jun 7, 2022·15 cites·15 claims
- 1795US10685836B2Etching substrates using ALE and selective depositionLAM RES CORP·Filed 2019·Granted Jun 16, 2020·10 cites·20 claims
- 1895US10534257B2Layout pattern proximity correction through edge placement error predictionLAM RES CORP·Filed 2017·Granted Jan 14, 2020·17 cites·14 claims
- 1995US9984858B2ALE smoothness: in and outside semiconductor industryLAM RES CORP·Filed 2016·Granted May 29, 2018·10 cites·20 claims
- 2094US10585347B2Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling frameworkLAM RES CORP·Filed 2018·Granted Mar 10, 2020·9 cites·21 claims
- 2193US12062538B2Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvementLAM RES CORP·Filed 2020·Granted Aug 13, 2024·3 cites·32 claims
- 2291US11987876B2Chamfer-less via integration schemeLAM RES CORP·Filed 2019·Granted May 21, 2024·6 cites·27 claims
- 2391US9922839B2Low roughness EUV lithographyLAM RES CORP·Filed 2016·Granted Mar 20, 2018·6 cites·16 claims
- 2490US12437995B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2022·Granted Oct 7, 2025·1 cites·5 claims
- 2589US10304659B2Ale smoothness: in and outside semiconductor industryLAM RES CORP·Filed 2018·Granted May 28, 2019·4 cites·20 claims
- 2687US12417916B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2021·Granted Sep 16, 2025·1 cites·16 claims
- 2786US10438807B2Low roughness EUV lithographyLAM RES CORP·Filed 2018·Granted Oct 8, 2019·3 cites·17 claims
- 2880US2025087498A1Tin oxide mandrels in patterningLAM RES CORP·Filed 2024·Application pending·0 cites
- 2980US2025246460A1Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2025·Application pending·0 cites
- 3078US9104113B2Amplification method for photoresist exposure in semiconductor chip manufacturingIBM·Filed 2013·Granted Aug 11, 2015·2 cites·16 claims
- 3178US7545041B2Techniques for patterning features in semiconductor devicesIBM·Filed 2006·Granted Jun 9, 2009·4 cites·1 claims
- 3277US7030008B2Techniques for patterning features in semiconductor devicesIBM·Filed 2003·Granted Apr 18, 2006·14 cites·26 claims
- 3374US12315727B2Eliminating yield impact of stochastics in lithographyLAM RES CORP·Filed 2021·Granted May 27, 2025·0 cites·13 claims
- 3473US2024429045A1Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvementLAM RES CORP·Filed 2024·Application pending·0 cites
- 3573US2024030031A1Tin oxide thin film spacers in semiconductor device manufacturingLAM RES CORP·Filed 2023·Application pending·0 cites
- 3671US2023045336A1Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2021·Application pending·0 cites
- 3769US6686296B1Nitrogen-based highly polymerizing plasma process for etching of organic materials in semiconductor manufacturingIBM·Filed 2000·Granted Feb 3, 2004·13 cites·23 claims
- 3869US6093281ABaffle plate design for decreasing conductance lost during precipitation of polymer precursors in plasma etching chambersIBM·Filed 1998·Granted Jul 25, 2000·19 cites·21 claims
- 3957US9064848B2ARC residue-free etchingGLOBALFOUNDRIES SG PTE LTD·Filed 2014·Granted Jun 23, 2015·0 cites·16 claims
- 4056US2008187731A1Techniques for Patterning Features in Semiconductor DevicesIBM·Filed 2008·Application pending·0 cites
- 4152US2023314946A1Method of forming photo-sensitive hybrid filmsLAM RES CORP·Filed 2021·Application pending·0 cites
- 4249US8901006B2ARC residue-free etchingHU XIANG·Filed 2011·Granted Dec 2, 2014·0 cites·10 claims
- 4343US2004112294A1Magnetic mirror for protection of consumable parts during plasma processingIBM·Filed 2003·Application pending·0 cites
- 4441US2004112544A1Magnetic mirror for preventing wafer edge damage during dry etchingFiled 2002·Application pending·0 cites
- 4540US2019131130A1Etching metal oxide substrates using ale and selective depositionLAM RES CORP·Filed 2017·Application pending·0 cites
- 4637US8642475B2Integrated circuit system with reduced polysilicon residue and method of manufacture thereofHU XIANG·Filed 2010·Granted Feb 4, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →