Inventor · disambiguated record
Chen-Hsiung Yang
Also filed as: YANG CHEN-HSIUNG
19 granted patents·6 pending applications·63 citations·filing 2004–2023
92Inventor score
Files withTOUCH MICRO SYSTEM TECH11TAIWAN SEMICONDUCTOR MFG CO LTD7YANG CHEN-HSIUNG3SHAO SHIH-FENG2SILICONWARE PRECISION INDUSTRIES CO LTD1
Top patents by PatentIndex Score
25 records- 0193US11186481B2Sensor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 30, 2021·6 cites·19 claims
- 0292US9550667B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 24, 2017·10 cites·20 claims
- 0380US12421103B2Microelectromechanical system deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 0479US11206493B2Sensor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 21, 2021·2 cites·19 claims
- 0578US7306955B2Method of performing a double-sided processTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Dec 11, 2007·5 cites·13 claims
- 0675US7297610B2Method of segmenting a waferTOUCH MICRO SYSTEM TECH·Filed 2005·Granted Nov 20, 2007·5 cites·17 claims
- 0773US11577954B2Method for forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 0872US10087071B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 2, 2018·1 cites·19 claims
- 0970US7008821B1Method of forming a wafer backside interconnecting wireTOUCH MICRO SYSTEM TECH·Filed 2004·Granted Mar 7, 2006·21 cites·20 claims
- 1067US7505118B2Wafer carrierTOUCH MICRO SYSTEM TECH·Filed 2004·Granted Mar 17, 2009·8 cites·20 claims
- 1165US7192842B2Method for bonding wafersTOUCH MICRO SYSTEM TECH·Filed 2005·Granted Mar 20, 2007·3 cites·12 claims
- 1264US10865099B2MEMS device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 1361US7410835B2Method for fabricating semiconductor package with short-prevented lead frameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Aug 12, 2008·2 cites·6 claims
- 1454US7566574B2Method of performing a double-sided processTOUCH MICRO SYSTEM TECH·Filed 2007·Granted Jul 28, 2009·0 cites·13 claims
- 1544US7465601B2Method of forming suspended structureTOUCH MICRO SYSTEM TECH·Filed 2007·Granted Dec 16, 2008·0 cites·15 claims
- 1643US7531457B2Method of fabricating suspended structureTOUCH MICRO SYSTEM TECH·Filed 2006·Granted May 12, 2009·0 cites·12 claims
- 1742US7582511B2Method for wafer level chip scale packaging with passive components integrated into packaging structureTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Sep 1, 2009·0 cites·22 claims
- 1842US2007184633A1Method of segmenting waferYANG CHEN-HSIUNG·Filed 2006·Application pending·0 cites
- 1940US7256128B2Method of double-sided etchingTOUCH MICRO SYSTEM TECH·Filed 2004·Granted Aug 14, 2007·0 cites·10 claims
- 2040US7045463B2Method of etching cavities having different aspect ratiosTOUCH MICRO SYSTEM TECH·Filed 2004·Granted May 16, 2006·0 cites·11 claims
- 2140US2007004172A1Method of thinning a waferYANG CHEN-HSIUNG·Filed 2005·Application pending·0 cites
- 2239US2006276006A1Method of segmenting a waferYANG CHEN-HSIUNG·Filed 2005·Application pending·0 cites
- 2338US2007158829A1Connecting module having passive componentsTOUCH MICRO SYSTEM CO LTD·Filed 2006·Application pending·0 cites
- 2434US2006030130A1Method of dicing a waferSHAO SHIH-FENG·Filed 2004·Application pending·0 cites
- 2533US2007077676A1Method of fabricating pressure sensorSHAO SHIH-FENG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →