Inventor · disambiguated record
Eric Blomiley
Also filed as: BLOMILEY ERIC · BLOMILEY ERIC R
27 granted patents·21 pending applications·179 citations·filing 2003–2019
96Inventor score
Top patents by PatentIndex Score
48 records- 0196US7557002B2Methods of forming transistor devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 7, 2009·40 cites·14 claims
- 0295US7956416B2Integrated circuitryMICRON TECHNOLOGY INC·Filed 2009·Granted Jun 7, 2011·23 cites·20 claims
- 0393US7531395B2Methods of forming a layer comprising epitaxial silicon, and methods of forming field effect transistorsMICRON TECHNOLOGY INC·Filed 2005·Granted May 12, 2009·22 cites·53 claims
- 0493US7528424B2Integrated circuitryMICRON TECHNOLOGY INC·Filed 2006·Granted May 5, 2009·15 cites·32 claims
- 0591US9972628B1Conductive structures, wordlines and transistorsMICRON TECHNOLOGY INC·Filed 2016·Granted May 15, 2018·7 cites·19 claims
- 0689US10411017B2Multi-component conductive structures for semiconductor devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 10, 2019·2 cites·5 claims
- 0786US8426919B2Integrated circuitryWELLS DAVID H·Filed 2011·Granted Apr 23, 2013·5 cites·10 claims
- 0886US8035129B2Integrated circuitryMICRON TECHNOLOGY INC·Filed 2010·Granted Oct 11, 2011·5 cites·21 claims
- 0983US7276416B2Method of forming a vertical transistorMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 2, 2007·6 cites·27 claims
- 1079US7662649B2Methods for assessing alignments of substrates within deposition apparatuses; and methods for assessing thicknesses of deposited layers within deposition apparatusesMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 16, 2010·5 cites·40 claims
- 1178US10164044B2Gate stacksMICRON TECHNOLOGY INC·Filed 2015·Granted Dec 25, 2018·2 cites·32 claims
- 1275US8872252B2Multi-tiered semiconductor apparatuses including residual silicide in semiconductor tierJINDAL ANURAG·Filed 2011·Granted Oct 28, 2014·3 cites·13 claims
- 1375US7517758B2Method of forming a vertical transistorMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 14, 2009·3 cites·33 claims
- 1474US7268023B2Method of forming a pseudo SOI substrate and semiconductor devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 11, 2007·5 cites·34 claims
- 1573US7132355B2Method of forming a layer comprising epitaxial silicon and a field effect transistorMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 7, 2006·10 cites·91 claims
- 1671US10147727B2Conductive structures, wordlines and transistorsMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 4, 2018·1 cites·16 claims
- 1770US7144779B2Method of forming epitaxial silicon-comprising materialMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 5, 2006·9 cites·43 claims
- 1869US8216935B2Methods of forming transistor gate constructions, methods of forming NAND transistor gate constructions, and methods forming DRAM transistor gate constructionsBLOMILEY ERIC R·Filed 2009·Granted Jul 10, 2012·5 cites·30 claims
- 1967US7768036B2Integrated circuitryMICRON TECHNOLOGY INC·Filed 2009·Granted Aug 3, 2010·1 cites·29 claims
- 2062US10991701B2Multi-component conductive structures for semiconductor devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Apr 27, 2021·0 cites·22 claims
- 2160US7585371B2Substrate susceptors for receiving semiconductor substrates to be deposited uponMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 8, 2009·2 cites·6 claims
- 2259US10777651B2Gate stacksMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 15, 2020·0 cites·19 claims
- 2357US6911367B2Methods of forming semiconductive materials having flattened surfaces; methods of forming isolation regions; and methods of forming elevated source/drain regionsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 28, 2005·5 cites·18 claims
- 2457US2006216945A1Methods of depositing materials over semiconductor substratesBLOMILEY ERIC R·Filed 2006·Application pending·0 cites
- 2557US2006243208A1Substrate susceptors for receiving semiconductor substrates to be deposited uponBLOMILEY ERIC R·Filed 2006·Application pending·0 cites
- 2657US2006180084A1Substrate susceptor for receiving a substrate to be deposited uponBLOMILEY ERIC R·Filed 2006·Application pending·0 cites
- 2757US2006180087A1Substrate susceptor for receiving a substrate to be deposited uponBLOMILEY ERIC R·Filed 2006·Application pending·0 cites
- 2857US2006191483A1Substrate susceptor for receiving a substrate to be deposited uponBLOMILEY ERIC R·Filed 2006·Application pending·0 cites
- 2957US2006243209A1Substrate susceptors for receiving semiconductor substrates to be deposited uponBLOMILEY ERIC R·Filed 2006·Application pending·0 cites
- 3056US7439136B2Method of forming a layer comprising epitaxial siliconMICRON TECHNOLOGY INC·Filed 2007·Granted Oct 21, 2008·0 cites·25 claims
- 3155US2007087576A1Substrate susceptor for receiving semiconductor substrates to be deposited uponBLOMILEY ERIC R·Filed 2006·Application pending·0 cites
- 3253US6987055B2Methods for deposition of semiconductor materialMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 17, 2006·3 cites·53 claims
- 3353US2015044860A1Multi-tiered semiconductor apparatuses including residual silicide in semiconductor tierMICRON TECHNOLOGY INC·Filed 2014·Application pending·0 cites
- 3451US7538392B2Pseudo SOI substrate and associated semiconductor devicesMICRON TECHNOLOGY INC·Filed 2007·Granted May 26, 2009·0 cites·21 claims
- 3550US7253085B2Deposition methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 7, 2007·0 cites·16 claims
- 3650US2006254506A1Methods of depositing an elemental silicon-comprising material over a substrateRAMASWAMY NIRMAL·Filed 2006·Application pending·0 cites
- 3748US2007020876A1Integrated circuitry, dynamic random access memory cells, electronic systems, and semiconductor processing methodsMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 3847US2006231016A1Deposition apparatusesBLOMILEY ERIC R·Filed 2006·Application pending·0 cites
- 3947US2007012241A1Methods of assessing the temperature of semiconductor wafer substrates within deposition apparatusesBLOMILEY ERIC R·Filed 2006·Application pending·0 cites
- 4046US2008233700A1Methods of forming integrated circuitryBLOMILEY ERIC R·Filed 2007·Application pending·0 cites
- 4146US2005217585A1Substrate susceptor for receiving a substrate to be deposited uponBLOMILEY ERIC R·Filed 2004·Application pending·0 cites
- 4245US2007181884A1Integrated circuitry, dynamic random access memory cells, and electronic systemsBLOMILEY ERIC R·Filed 2007·Application pending·0 cites
- 4345US2007184607A1Methods of forming integrated circuitry, and methods of forming dynamic random access memory cellsBLOMILEY ERIC R·Filed 2007·Application pending·0 cites
- 4443US2005217569A1Methods of depositing an elemental silicon-comprising material over a semiconductor substrate and methods of cleaning an internal wall of a chamberRAMASWAMY NIRMAL·Filed 2004·Application pending·0 cites
- 4542US2010187660A1Method To Create SOI Layer For 3D-Stacking Memory ArrayTANG SANH·Filed 2009·Application pending·0 cites
- 4639US2005223985A1Deposition apparatuses, methods of assessing the temperature of semiconductor wafer substrates within deposition apparatuses, and methods for deposition of epitaxial semiconductive materialBLOMILEY ERIC R·Filed 2004·Application pending·0 cites
- 4738US2006255412A1Enhanced access devices using selective epitaxial silicon over the channel region during the formation of a semiconductor device and systems including sameRAMASWAMY NIRMAL·Filed 2005·Application pending·0 cites
- 4838US2005223993A1Deposition apparatuses; methods for assessing alignments of substrates within deposition apparatuses; and methods for assessing thicknesses of deposited layers within deposition apparatusesBLOMILEY ERIC R·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →