Inventor · disambiguated record
Hidehisa Sakai
Also filed as: SAKAI HIDEHISA
14 granted patents·3 pending applications·209 citations·filing 1993–2019
90Inventor score
Top patents by PatentIndex Score
17 records- 0196US5475922AMethod of assembling a connector using frangible contact partsFUJITSU LTD·Filed 1994·Granted Dec 19, 1995·148 cites·4 claims
- 0277US8190378B2Crack growth evaluation apparatus, crack growth evaluation method, and recording medium recording crack growth evaluation programSAKAI HIDEHISA·Filed 2008·Granted May 29, 2012·8 cites·8 claims
- 0371US7467076B2Apparatus for predicting reliability in electronic device package, program for predicting reliability in electronic device package, and method for predicting reliability in electronic device packageFUJITSU LTD·Filed 2006·Granted Dec 16, 2008·6 cites·6 claims
- 0469US8204699B2Analyzing apparatus, analyzing method, and computer-readable recording medium storing an analyzing programSAKAI HIDEHISA·Filed 2010·Granted Jun 19, 2012·2 cites·9 claims
- 0569US7139678B2Method and apparatus for predicting board deformation, and computer productFUJITSU LTD·Filed 2004·Granted Nov 21, 2006·15 cites·11 claims
- 0668US7725866B2Electronic package evaluation apparatus, electronic package optimizing apparatus, and computer-readable recording medium in which electronic package evaluation program is recordedFUJITSU LTD·Filed 2007·Granted May 25, 2010·5 cites·17 claims
- 0762US5738550APress-fit pin fitting in a miniaturized through hole formed in a circuit boardFUJITSU LTD·Filed 1996·Granted Apr 14, 1998·22 cites·8 claims
- 0861US9990445B2Decoupled parallel meshing in computer aided designFUJITSU LTD·Filed 2013·Granted Jun 5, 2018·1 cites·5 claims
- 0959US10575392B2Cooling systemFUJITSU LTD·Filed 2019·Granted Feb 25, 2020·0 cites·11 claims
- 1047US2010053923A1Semiconductor device and circuit board assemblyFUJITSU LTD·Filed 2009·Application pending·0 cites
- 1146US9471716B2Setting method and information processing apparatusFUJITSU LTD·Filed 2013·Granted Oct 18, 2016·0 cites·5 claims
- 1246US8816510B2Semiconductor apparatus, substrate design method, and substrate design apparatusMATSUI NORIYUKI·Filed 2009·Granted Aug 26, 2014·0 cites·14 claims
- 1346US7873501B2Crack growth evaluation apparatus, crack growth evaluation method, and recording medium recording crack growth evaluation programFUJITSU LTD·Filed 2007·Granted Jan 18, 2011·0 cites·14 claims
- 1446US2018135920A1Heat exchanger, information processing device, and flat tube manufacturing methodFUJITSU LTD·Filed 2017·Application pending·0 cites
- 1542US7773814B2Multi-scale analysis deviceFUJITSU LTD·Filed 2005·Granted Aug 10, 2010·0 cites·4 claims
- 1642US2008004855A1Design support apparatus, design support method, and design support programSAKAI HIDEHISA·Filed 2007·Application pending·0 cites
- 1731US5354209AConnector and method of assembling the sameFUJITSU LTD·Filed 1993·Granted Oct 11, 1994·2 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →