Inventor · disambiguated record
Hisato Takahashi
Also filed as: TAKAHASHI HISATO
14 granted patents·2 pending applications·247 citations·filing 1988–2023
89Inventor score
Files withHITACHI CHEMICAL CO LTD6SHOWA DENKO MATERIALS CO LTD4SUMITOMO ELECTRIC INDUSTRIES2RESONAC CORP1TAKAHASHI HISATO1
Top patents by PatentIndex Score
16 records- 0189US5596665AOptical module having structure for defining fixing position of sleeveSUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Jan 21, 1997·102 cites·16 claims
- 0281US5416871AMolded optical connector moduleSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted May 16, 1995·80 cites·41 claims
- 0377US12365815B2Polishing liquid, polishing liquid set, polishing method, and defect suppression methodRESONAC CORP·Filed 2023·Granted Jul 22, 2025·0 cites·18 claims
- 0466US4912310AMethod of and system for issuing cardsUEMURA YOSHITAKA·Filed 1988·Granted Mar 27, 1990·59 cites·38 claims
- 0564US11873414B2Sealing resin composition, electronic component device, and method of manufacturing electronic component deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·15 claims
- 0656US8232355B2Liquid resin composition for electronic components and electronic component deviceTAKAHASHI HISATO·Filed 2006·Granted Jul 31, 2012·3 cites·24 claims
- 0752US2020283659A1Polishing liquid, polishing liquid set, polishing method, anddefect suppression methodHITACHI CHEMICAL CO LTD·Filed 2018·Application pending·0 cites
- 0850US11186742B2Sealing resin composition, electronic component device, and method of manufacturing electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Nov 30, 2021·0 cites·16 claims
- 0949US11926764B2Polishing solution, polishing solution set, polishing method, and defect suppressing methodSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Mar 12, 2024·0 cites·30 claims
- 1046US5744559AMacro-azo initiatorWAKO PURE CHEM IND LTD·Filed 1997·Granted Apr 28, 1998·3 cites·8 claims
- 1145US11999875B2Polishing solution and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jun 4, 2024·0 cites·19 claims
- 1243US2023054199A1Cmp polishing liquid and polishing methodSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 1341US12454612B2Liquid resin composition for compression molding and electronic component apparatusHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 28, 2025·0 cites·10 claims
- 1438US12131970B2Liquid resin composition for sealing and electronic component apparatusHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 29, 2024·0 cites·20 claims
- 1538US11059966B2Liquid epoxy resin composition for sealing, and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Jul 13, 2021·0 cites·15 claims
- 1630US12269943B2Liquid resin composition for sealing and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Apr 8, 2025·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →