Inventor · disambiguated record
Mitsuo Umemoto
Also filed as: UMEMOTO MITSUO
35 granted patents·5 pending applications·511 citations·filing 1993–2016
97Inventor score
Top patents by PatentIndex Score
40 records- 0196US7339273B2Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrodeSANYO ELECTRIC CO·Filed 2005·Granted Mar 4, 2008·46 cites·9 claims
- 0295US7582971B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2005·Granted Sep 1, 2009·40 cites·10 claims
- 0395US7094701B2Manufacturing method of semiconductor deviceNEC CORP·Filed 2005·Granted Aug 22, 2006·55 cites·12 claims
- 0493US7646079B2Semiconductor device, method of manufacturing the same, circuit board, and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2006·Granted Jan 12, 2010·28 cites·6 claims
- 0591US7485967B2Semiconductor device with via hole for electric connectionSANYO ELECTRIC CO·Filed 2006·Granted Feb 3, 2009·20 cites·6 claims
- 0690US7646100B2Semiconductor device with penetrating electrodeSANYO ELECTRIC CO·Filed 2005·Granted Jan 12, 2010·22 cites·6 claims
- 0790US7282444B2Semiconductor chip and manufacturing method for the same, and semiconductor deviceTOSHIBA KK·Filed 2004·Granted Oct 16, 2007·62 cites·24 claims
- 0887US7732925B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Jun 8, 2010·14 cites·8 claims
- 0986US7670955B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2008·Granted Mar 2, 2010·12 cites·6 claims
- 1084US9589842B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 7, 2017·5 cites·20 claims
- 1181US5368852AProlonged-release liquid type of pharmaceutical preparation comprising drug-resin complex and benzoate preservativeROHNTO PHARMACEUTICAL CO LTD·Filed 1993·Granted Nov 29, 1994·90 cites·15 claims
- 1280US9991245B2Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the sameKIM JAE CHOON·Filed 2015·Granted Jun 5, 2018·4 cites·10 claims
- 1379US7397128B2Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2006·Granted Jul 8, 2008·11 cites·5 claims
- 1478US8697494B2Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the methodJEON CHANG-SEONG·Filed 2011·Granted Apr 15, 2014·5 cites·13 claims
- 1576US7906430B2Method of manufacturing a semiconductor device with a peeling prevention layerSANYO ELECTRIC CO·Filed 2008·Granted Mar 15, 2011·6 cites·6 claims
- 1676US7638421B2Manufacturing method for semiconductor device and semiconductor deviceROHM CO LTD·Filed 2007·Granted Dec 29, 2009·6 cites·9 claims
- 1776US7416963B2Manufacturing method of semiconductor deviceUMEMOTO MITSUO·Filed 2005·Granted Aug 26, 2008·9 cites·14 claims
- 1871US7750478B2Semiconductor device with via hole of uneven widthSANYO ELECTRIC CO·Filed 2007·Granted Jul 6, 2010·4 cites·10 claims
- 1969US7227262B2Manufacturing method for semiconductor device and semiconductor deviceSANYO ELECTRIC CO·Filed 2004·Granted Jun 5, 2007·13 cites·1 claims
- 2068US7382037B2Semiconductor device with a peeling prevention layerSANYO ELECTRIC CO·Filed 2005·Granted Jun 3, 2008·3 cites·7 claims
- 2167US8552545B2Manufacturing method for semiconductor device, semiconductor device and semiconductor chipTANIDA KAZUMASA·Filed 2005·Granted Oct 8, 2013·3 cites·11 claims
- 2267US7495881B2Chucking method and processing method using the sameSANYO ELECTRIC CO·Filed 2005·Granted Feb 24, 2009·2 cites·32 claims
- 2366US8004848B2Stack module, card including the stack module, and system including the stack moduleSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 23, 2011·3 cites·23 claims
- 2466US7235428B2Semiconductor device production methodROHM CO LTD·Filed 2003·Granted Jun 26, 2007·11 cites·14 claims
- 2565US10105102B2Package for processing sensed-data, sensed-data processor, and system for processing sensed-dataSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 23, 2018·1 cites·10 claims
- 2665US8736047B2Semiconductor device and manufacturing method thereofYOSHIMI HIDEAKI·Filed 2007·Granted May 27, 2014·5 cites·11 claims
- 2763US8089163B2Semiconductor device production method and semiconductor deviceTANIDA KAZUMASA·Filed 2006·Granted Jan 3, 2012·2 cites·15 claims
- 2860US7306972B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Dec 11, 2007·1 cites·5 claims
- 2958US9165898B2Method of manufacturing semiconductor device with through holeKAMEYAMA KOJIRO·Filed 2008·Granted Oct 20, 2015·2 cites·11 claims
- 3058US5334378APharmaceutical formulation in the form of aqueous suspensionROHTO PHARMA·Filed 1993·Granted Aug 2, 1994·25 cites·10 claims
- 3156US2009141275A1Alignment inspection method and alignment inspection apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3252US8076755B2Semiconductor device and method of manufacturing the sameUMEMOTO MITSUO·Filed 2008·Granted Dec 13, 2011·1 cites·7 claims
- 3351US2014196280A1Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the methodSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 3449US9917010B2Semiconductor device manufacturing methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Mar 13, 2018·0 cites·9 claims
- 3549US8404586B2Manufacturing method for semiconductor deviceTANIDA KAZUMASA·Filed 2006·Granted Mar 26, 2013·0 cites·22 claims
- 3648US2009321432A1Apparatus for Processing a WaferHAN II-YOUNG·Filed 2009·Application pending·0 cites
- 3742US7061107B2Semiconductor device and manufacturing method of the sameROHM CO LTD·Filed 2004·Granted Jun 13, 2006·0 cites·4 claims
- 3841US2007035020A1Semiconductor Apparatus and Semiconductor ModuleKANTO SANYO SEMICONDUCTORS CO·Filed 2005·Application pending·0 cites
- 3939US7169639B2Semiconductor device manufacturing methodROHM CO LTD·Filed 2004·Granted Jan 30, 2007·0 cites·7 claims
- 4034US2016197057A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →