Inventor · disambiguated record
Yu-Fang Tsai
Also filed as: TSAI YU-FANG · TSAI YU-FANG EDDIE
20 granted patents·6 pending applications·304 citations·filing 1999–2024
95Inventor score
Top patents by PatentIndex Score
26 records- 0192US7026709B2Stacked chip-packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Apr 11, 2006·98 cites·14 claims
- 0287US6564449B1Method of making wire connection in semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted May 20, 2003·50 cites·21 claims
- 0386US7291926B2Multi-chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Nov 6, 2007·10 cites·17 claims
- 0483US7129583B2Multi-chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 31, 2006·22 cites·4 claims
- 0581US8502363B2Semiconductor device packages with solder joint enhancement element and related methodsCHIANG PO-SHING·Filed 2012·Granted Aug 6, 2013·8 cites·20 claims
- 0680US8674487B2Semiconductor packages with lead extensions and related methodsYU LIN-WANG·Filed 2012·Granted Mar 18, 2014·12 cites·18 claims
- 0778US2024332274A1Optical device packageADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0875US12009353B2Optical device package with compatible lid and carrierADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jun 11, 2024·0 cites·7 claims
- 0970US9059379B2Light-emitting semiconductor packages and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2012·Granted Jun 16, 2015·3 cites·19 claims
- 1064US7253529B2Multi-chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 7, 2007·7 cites·12 claims
- 1163US11302682B2Optical device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 12, 2022·0 cites·20 claims
- 1262US6161753AMethod of making a low-profile wire connection for stacked diesADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Dec 19, 2000·28 cites·4 claims
- 1359US6244499B1Structure of a ball bump for wire bonding and the formation thereofADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jun 12, 2001·24 cites·2 claims
- 1458US11042630B2Dynamic page similarity measurementTREND MICRO INC·Filed 2019·Granted Jun 22, 2021·0 cites·17 claims
- 1557US10951636B2Dynamic phishing detection methods and apparatusTREND MICRO INC·Filed 2019·Granted Mar 16, 2021·0 cites·5 claims
- 1653US2007290318A1Multi-chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 1752US7037750B2Method for manufacturing a packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 2, 2006·6 cites·11 claims
- 1852US6176416B1Method of making low-profile wire connectionADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jan 23, 2001·17 cites·12 claims
- 1951US8994156B2Semiconductor device packages with solder joint enhancement elementsADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Mar 31, 2015·0 cites·16 claims
- 2050US2006055019A1Multi-chip package structureTAO SU·Filed 2005·Application pending·0 cites
- 2148US2008163369A1Dynamic phishing detection methods and apparatusCHANG MING-TAI ALLEN·Filed 2006·Application pending·0 cites
- 2247US7015065B2Manufacturing method of ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Mar 21, 2006·2 cites·15 claims
- 2347US6176417B1Ball bonding method on a chipADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jan 23, 2001·14 cites·8 claims
- 2442US2006138631A1Multi-chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 2534US2001022315A1Structure of a ball bump for wire bonding and the formation thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Application pending·0 cites
- 2631US6195258B1Thermal board used for bonding wires in semiconductor manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Feb 27, 2001·3 cites·10 claims
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