Multi-chip package structure

Abstract

The present invention relates to a multi-chip package structure, comprising a first substrate, a first chip, a sub-package and a first molding compound. The first chip is attached to the first substrate. The first molding compound encapsulates the first chip, the sub-package and the top surface of the first substrate. The bottom surface of the sub-package is attached to the first chip. The sub-package comprises a second substrate, a second chip and a second molding compound. The second substrate has a top surface and a bottom surface, and is electrically connected to the first chip. The second chip is attached to the top surface of the second substrate to which the second chip is electrically connected. The second molding compound encapsulates the second chip and part of the top surface of the second substrate. Whereby, the relative large area caused by the parallel arrangement of a plurality of conventional package structures can be reduced, and there is no need to redesign signal-transmitting path.

1 . A multi-chip package structure comprising: 
 a first substrate having a top surface and a bottom surface;    a sub-package having a top surface and a bottom surface, wherein the bottom surface of the sub-package is attached to the top surface of the first substrate, the sub-package including: 
 a second substrate having a top surface and a bottom surface, the second substrate being electrically connected to the first substrate;  
 a second chip attached to the bottom surface of the second substrate and electrically connected to the second substrate; and  
 a second molding compound used for encapsulating the second chip and part of the bottom surface of the second substrate;  
   a first chip attached to the top surface of the sub-package and electrically connected to the first substrate;    a first molding compound used for encapsulating the first chip, the sub-package and the top surface of the first substrate.    
     
     
         2 . The package structure according to  claim 1 , wherein the sub-package further including a third chip attached to the bottom surface of the second substrate and electrically connected to the second substrate.