Inventor · disambiguated record
Ji-Hyuk Lim
Also filed as: LIM JI HYUK
34 granted patents·8 pending applications·242 citations·filing 2003–2024
96Inventor score
Top patents by PatentIndex Score
42 records- 0197US7285865B2Micro-package, multi-stack micro-package, and manufacturing method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 23, 2007·57 cites·23 claims
- 0293US8872041B2Multilayer laminate package and method of manufacturing the sameLEE BAIK-WOO·Filed 2011·Granted Oct 28, 2014·24 cites·23 claims
- 0392US11901128B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Feb 13, 2024·3 cites·20 claims
- 0492US7667946B2Tunable capacitor using electrowetting phenomenonSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 23, 2010·19 cites·15 claims
- 0590US7374972B2Micro-package, multi-stack micro-package, and manufacturing method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 20, 2008·18 cites·15 claims
- 0687US7545017B2Wafer level package for surface acoustic wave device and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 9, 2009·10 cites·11 claims
- 0786US7755151B2Wafer level package for surface acoustic wave device and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 13, 2010·15 cites·11 claims
- 0885US7018017B2Monolithic ink-jet printhead having a heater disposed between dual ink chambers and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 28, 2006·24 cites·24 claims
- 0984US7449366B2Wafer level packaging cap and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 11, 2008·12 cites·18 claims
- 1082US9263187B2Multilayer ceramic electronic component and method of manufacturing the sameLEE KWANG JIK·Filed 2012·Granted Feb 16, 2016·5 cites·11 claims
- 1181US11694838B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 4, 2023·1 cites·11 claims
- 1281US7487590B2Method for manufacturing monolithic ink-jet printhead having heater disposed between dual ink chambersSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 10, 2009·5 cites·24 claims
- 1379US8552617B2Energy harvesting device using pyroelectric materialLIM JI-HYUK·Filed 2010·Granted Oct 8, 2013·12 cites·9 claims
- 1477US12154722B2Capacitor componentSAMSUNG ELECTRO MECH·Filed 2024·Granted Nov 26, 2024·0 cites·16 claims
- 1576US7626258B2Cap wafer, semiconductor chip having the same, and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Dec 1, 2009·6 cites·9 claims
- 1674US8045318B2Tunable capacitor using electrowetting phenomenonSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Oct 25, 2011·3 cites·19 claims
- 1768US7906841B2Wafer level incapsulation chip and encapsulation chip manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 15, 2011·4 cites·5 claims
- 1867US12051532B2Coil component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Jul 30, 2024·0 cites·22 claims
- 1967US7163278B2Ink-jet printhead with improved ink ejection linearity and operating frequencySAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 16, 2007·11 cites·13 claims
- 2065US11830654B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 28, 2023·0 cites·19 claims
- 2163US9189105B2Touch sensorSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 17, 2015·1 cites·18 claims
- 2259US8682657B2Apparatus and method for improving communication sound quality in mobile terminalLIM JI-HYUK·Filed 2011·Granted Mar 25, 2014·3 cites·16 claims
- 2359US7732981B2Ultrasonic motor having lightweight vibrating elementSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 8, 2010·2 cites·17 claims
- 2455US8755167B2Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic componentLEE KWANG JIK·Filed 2011·Granted Jun 17, 2014·0 cites·5 claims
- 2553US7210766B2Thermally-driven ink-jet printhead capable of preventing cavitation damage to a heaterSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 1, 2007·4 cites·40 claims
- 2650US2015162134A1Multilayer thin film for ceramic electronic component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2749US11908626B2Multilayer ceramic electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Feb 20, 2024·0 cites·30 claims
- 2848US8974901B2Multilayer thin film for ceramic electronic component and method of manufacturing the sameLEE KWANG JIK·Filed 2011·Granted Mar 10, 2015·0 cites·6 claims
- 2948US7101024B2Ink-jet printheadSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 5, 2006·3 cites·19 claims
- 3048US2007188558A1Thermally-driven ink-jet printhead capable of preventing cavitation damage to a heaterSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3148US2014139835A1Measurement device of degree of cureSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3247US9065071B2Organic light emitting device with a protective layer including at least one of a nano-clay and a graphite oxide formed on the anodeLEE KWANG JIK·Filed 2011·Granted Jun 23, 2015·0 cites·10 claims
- 3347US8049396B2Piezoelectric ultrasonic motor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 1, 2011·0 cites·6 claims
- 3444US7741774B2Backlight module including at least one luminescence element, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 22, 2010·0 cites·9 claims
- 3544US2006040404A1Inkjet spotting apparatus for manufacturing microarrays and method of spotting using the sameLIM JI-HYUK·Filed 2005·Application pending·0 cites
- 3643US8237330B2Vibrating element, fabrication method thereof, and ultrasonic motor having the sameCHO JIN-WOO·Filed 2009·Granted Aug 7, 2012·0 cites·30 claims
- 3742US8274198B2Ultrasonic motor and conveying apparatus having the samePARK SUNGHYUK·Filed 2009·Granted Sep 25, 2012·0 cites·35 claims
- 3842US2014185244A1Thermally conductive film and circuit board moduleSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3941US2013048943A1Organic light emitting diode and fabrication method thereofLEE KWANG JIK·Filed 2012·Application pending·0 cites
- 4041US2013038982A1Multilayer ceramic condenser and method for manufacturing the sameLEE KWANG JIK·Filed 2012·Application pending·0 cites
- 4139US2016349831A1Electronic device and power managing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 4236US7216959B2Apparatus and method for driving an ink-jet printheadSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 15, 2007·0 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →