Inventor · disambiguated record
Kin Pui Kwan
Also filed as: KWAN KIN PUI
18 granted patents·1,328 citations·filing 2001–2012
96Inventor score
Top patents by PatentIndex Score
18 records- 0198US6995460B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2005·Granted Feb 7, 2006·119 cites·19 claims
- 0298US6946324B1Process for fabricating a leadless plastic chip carrierASAT LTD·Filed 2003·Granted Sep 20, 2005·182 cites·10 claims
- 0398US6635957B2Leadless plastic chip carrier with etch back pad singulation and die attach pad arrayASAT LTD·Filed 2001·Granted Oct 21, 2003·199 cites·13 claims
- 0497US7358119B2Thin array plastic package without die attach pad and process for fabricating the sameASAT LTD·Filed 2005·Granted Apr 15, 2008·78 cites·24 claims
- 0597US7009286B1Thin leadless plastic chip carrierASAT LTD·Filed 2004·Granted Mar 7, 2006·117 cites·11 claims
- 0696US7226811B1Process for fabricating a leadless plastic chip carrierASAT LTD·Filed 2005·Granted Jun 5, 2007·55 cites·3 claims
- 0796US6989294B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2003·Granted Jan 24, 2006·101 cites·8 claims
- 0896US6933594B2Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2001·Granted Aug 23, 2005·140 cites·12 claims
- 0995US7271032B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2005·Granted Sep 18, 2007·43 cites·29 claims
- 1095US7081403B1Thin leadless plastic chip carrierASAT LTD·Filed 2005·Granted Jul 25, 2006·28 cites·14 claims
- 1192US6734044B1Multiple leadframe laminated IC packageASAT LTD·Filed 2002·Granted May 11, 2004·78 cites·9 claims
- 1290US7232755B1Process for fabricating pad frame and integrated circuit packageASAT LTD·Filed 2005·Granted Jun 19, 2007·20 cites·21 claims
- 1388US7449771B1Multiple leadframe laminated IC packageASAT LTD·Filed 2003·Granted Nov 11, 2008·56 cites·5 claims
- 1488US6872661B1Leadless plastic chip carrier with etch back pad singulation and die attach pad arrayASAT LTD·Filed 2002·Granted Mar 29, 2005·53 cites·19 claims
- 1583US7270867B1Leadless plastic chip carrierASAT LTD·Filed 2004·Granted Sep 18, 2007·34 cites·11 claims
- 1674US8330270B1Integrated circuit package having a plurality of spaced apart pad portionsLIN GERALDINE TSUI YEE·Filed 2004·Granted Dec 11, 2012·22 cites·15 claims
- 1764US9806006B2Etch isolation LPCC/QFN stripLI TUNG LOK·Filed 2007·Granted Oct 31, 2017·3 cites·20 claims
- 1847US9520306B2Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portionLIN GERALDINE TSUI YEE·Filed 2012·Granted Dec 13, 2016·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →