Inventor · disambiguated record
Huili Fu
Also filed as: FU HUILI
12 granted patents·10 pending applications·23 citations·filing 2006–2022
86Inventor score
Files withHUAWEI TECH CO LTD18HK APPLIED SCIENCE & TECH RES2SHAM MAN-LUNG1T HEAD SHANGHAI SEMICONDUCTOR CO LTD1
Top patents by PatentIndex Score
22 records- 0184US9349708B2Chip stacked package structure and electronic deviceHUAWEI TECH CO LTD·Filed 2015·Granted May 24, 2016·5 cites·17 claims
- 0282US10727595B2Patch antenna unit and antennaHUAWEI TECH CO LTD·Filed 2018·Granted Jul 28, 2020·4 cites·16 claims
- 0382US9681549B2Conical inductor, printed circuit board, and optical moduleHUAWEI TECH CO LTD·Filed 2016·Granted Jun 13, 2017·3 cites·8 claims
- 0479US10784181B2Apparatus and manufacturing methodHUAWEI TECH CO LTD·Filed 2018·Granted Sep 22, 2020·4 cites·19 claims
- 0574US11189927B2Patch antenna unit and antennaHUAWEI TECH CO LTD·Filed 2020·Granted Nov 30, 2021·1 cites·20 claims
- 0670US11276645B2Encapsulation of a substrate electrically connected to a plurality of pin arraysHUAWEI TECH CO LTD·Filed 2020·Granted Mar 15, 2022·1 cites·16 claims
- 0767US10475741B2ChipHUAWEI TECH CO LTD·Filed 2017·Granted Nov 12, 2019·1 cites·13 claims
- 0865US8241966B2Methods of making an electronic component package and semiconductor chip packagesSHAM MAN-LUNG·Filed 2009·Granted Aug 14, 2012·3 cites·6 claims
- 0957US8031484B2IC packages with internal heat dissipation structuresHK APPLIED SCIENCE & TECH RES·Filed 2006·Granted Oct 4, 2011·1 cites·22 claims
- 1051US11462520B2Chip integration module, chip package structure, and chip integration methodHUAWEI TECH CO LTD·Filed 2018·Granted Oct 4, 2022·0 cites·11 claims
- 1149US2023290723A1Conductive via structures for far-end crosstalk cancellationT HEAD SHANGHAI SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 1246US2008067650A1Electronic component package with EMI shieldingHK APPLIED SCIENCE & TECH RES·Filed 2006·Application pending·0 cites
- 1344US2016035689A1Chip integration module, chip package structure, and chip integration methodHUAWEI TECH CO LTD·Filed 2015·Application pending·0 cites
- 1442US10903135B2Chip package structure and manufacturing method thereofHUAWEI TECH CO LTD·Filed 2017·Granted Jan 26, 2021·0 cites·16 claims
- 1542US2020135615A1Chip package structureHUAWEI TECH CO LTD·Filed 2019·Application pending·0 cites
- 1641US2019273044A1Chip Package Structure And Packaging MethodHUAWEI TECH CO LTD·Filed 2019·Application pending·0 cites
- 1741US2013221537A1Semiconductor device and electronic apparatusHUAWEI TECH CO LTD·Filed 2013·Application pending·0 cites
- 1840US2020161766A1Antenna-in-package structure and terminalHUAWEI TECH CO LTD·Filed 2019·Application pending·0 cites
- 1936US2018308789A1Packaging structure, electronic device, and packaging methodHUAWEI TECH CO LTD·Filed 2018·Application pending·0 cites
- 2035US10607913B2Integrated circuit die and manufacture method thereofHUAWEI TECH CO LTD·Filed 2017·Granted Mar 31, 2020·0 cites·13 claims
- 2135US2018114760A1Package Substrate and Fabrication Method Thereof, and Integrated Circuit ChipHUAWEI TECH CO LTD·Filed 2017·Application pending·0 cites
- 2234US2018247880A1Chip Packaging SystemHUAWEI TECH CO LTD·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →