Inventor · disambiguated record
Steven E. Molis
Also filed as: MOLIS STEVEN E · MOLIS STEVEN EARLE
16 granted patents·2 pending applications·303 citations·filing 1988–2015
94Inventor score
Top patents by PatentIndex Score
18 records- 0197US8420531B2Enhanced diffusion barrier for interconnect structuresYANG CHIH-CHAO·Filed 2011·Granted Apr 16, 2013·29 cites·20 claims
- 0291US8742581B2Enhanced diffusion barrier for interconnect structuresIBM·Filed 2013·Granted Jun 3, 2014·9 cites·19 claims
- 0389US7838428B2Method of repairing process induced dielectric damage by the use of GCIB surface treatment using gas clusters of organic molecular speciesIBM·Filed 2006·Granted Nov 23, 2010·16 cites·10 claims
- 0485US7615482B2Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strengthIBM·Filed 2007·Granted Nov 10, 2009·6 cites·21 claims
- 0585US6149840AElectrically conductive polymeric materials and use thereofIBM·Filed 1997·Granted Nov 21, 2000·45 cites·5 claims
- 0682US5591285AFluorinated carbon polymer compositesIBM·Filed 1995·Granted Jan 7, 1997·38 cites·12 claims
- 0781US5397863AFluorinated carbon polymer compositesIBM·Filed 1992·Granted Mar 14, 1995·35 cites·17 claims
- 0881US5019210AMethod for enhancing the adhesion of polymer surfaces by water vapor plasma treatmentIBM·Filed 1989·Granted May 28, 1991·40 cites·16 claims
- 0976US5556899AFluorinated carbon polymer compositesIBM·Filed 1994·Granted Sep 17, 1996·28 cites·8 claims
- 1068US5571852AFluorinated carbon polymer compositesIBM·Filed 1995·Granted Nov 5, 1996·20 cites·14 claims
- 1164US9040390B2Releasable buried layer for 3-D fabrication and methods of manufacturingDAUBENSPECK TIMOTHY H·Filed 2012·Granted May 26, 2015·1 cites·18 claims
- 1260US7932342B2Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend systemIBM·Filed 2008·Granted Apr 26, 2011·0 cites·1 claims
- 1355US2010009161A1STRUCTURE AND METHOD FOR SiCOH INTERFACES WITH INCREASED MECHANICAL STRENGTHIBM·Filed 2009·Application pending·0 cites
- 1454US6168732B1Electrically conductive polymeric materials and use thereofIBM·Filed 1998·Granted Jan 2, 2001·12 cites·4 claims
- 1554US4846929AWet etching of thermally or chemically cured polyimideIBM·Filed 1988·Granted Jul 11, 1989·20 cites·37 claims
- 1648US7737029B2Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 15, 2010·0 cites·18 claims
- 1745US7585431B1Electrically conductive polymeric materials and use thereofIBM·Filed 1993·Granted Sep 8, 2009·4 cites·4 claims
- 1830US2017154763A1Mass spectrometry system and method for contaminant identification in semiconductor fabricationGLOBALFOUNDRIES INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →