Inventor · disambiguated record
Ellis Chau
Also filed as: CHAU ELLIS
40 granted patents·5 pending applications·1,283 citations·filing 2004–2024
98Inventor score
Top patents by PatentIndex Score
45 records- 0199US8878353B2Structure for microelectronic packaging with bond elements to encapsulation surfaceINVENSAS CORP·Filed 2012·Granted Nov 4, 2014·137 cites·71 claims
- 0299US8728865B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2011·Granted May 20, 2014·88 cites·16 claims
- 0399US8093697B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2010·Granted Jan 10, 2012·117 cites·16 claims
- 0499US8058101B2Microelectronic packages and methods thereforHABA BELGACEM·Filed 2005·Granted Nov 15, 2011·87 cites·16 claims
- 0598US9502390B2BVA interposerINVENSAS CORP·Filed 2013·Granted Nov 22, 2016·59 cites·27 claims
- 0698US9224717B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2014·Granted Dec 29, 2015·76 cites·20 claims
- 0798US9105483B2Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Aug 11, 2015·60 cites·29 claims
- 0898US9093435B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2013·Granted Jul 28, 2015·68 cites·23 claims
- 0998US9095074B2Structure for microelectronic packaging with bond elements to encapsulation surfaceINVENSAS CORP·Filed 2014·Granted Jul 28, 2015·66 cites·20 claims
- 1098US9041227B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2013·Granted May 26, 2015·37 cites·16 claims
- 1198US8836136B2Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Sep 16, 2014·84 cites·29 claims
- 1298US8618659B2Package-on-package assembly with wire bonds to encapsulation surfaceSATO HIROAKI·Filed 2012·Granted Dec 31, 2013·147 cites·38 claims
- 1398US8404520B1Package-on-package assembly with wire bond viasCHAU ELLIS·Filed 2012·Granted Mar 26, 2013·112 cites·27 claims
- 1497US11830845B2Package-on-package assembly with wire bonds to encapsulation surfaceADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2022·Granted Nov 28, 2023·4 cites·19 claims
- 1597US8940630B2Method of making wire bond vias and microelectronic package having wire bond viasINVENSAS CORP·Filed 2013·Granted Jan 27, 2015·48 cites·32 claims
- 1697US8697492B2No flow underfillHABA BELGACEM·Filed 2010·Granted Apr 15, 2014·36 cites·19 claims
- 1792US2025118705A1Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Application pending·0 cites
- 1891US10062661B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2017·Granted Aug 28, 2018·5 cites·14 claims
- 1989US10297582B2BVA interposerINVENSAS CORP·Filed 2015·Granted May 21, 2019·6 cites·11 claims
- 2089US9761558B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2015·Granted Sep 12, 2017·4 cites·16 claims
- 2188US9029759B2Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the sameSINGH HARPUNEET·Filed 2012·Granted May 12, 2015·12 cites·46 claims
- 2285US12211821B2Package-on-package assembly with wire bond viasADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 2385US11424211B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA LLC·Filed 2020·Granted Aug 23, 2022·1 cites·29 claims
- 2484US8222725B2Metal can impedance control structureHABA BELGACEM·Filed 2010·Granted Jul 17, 2012·7 cites·64 claims
- 2582US9615456B2Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surfaceINVENSAS CORP·Filed 2015·Granted Apr 4, 2017·3 cites·20 claims
- 2682US8786083B2Impedance controlled packages with metal sheet or 2-layer RDLHABA BELGACEM·Filed 2010·Granted Jul 22, 2014·5 cites·29 claims
- 2780US9218988B2Microelectronic packages and methods thereforTESSERA INC·Filed 2014·Granted Dec 22, 2015·3 cites·17 claims
- 2878US11735563B2Package-on-package assembly with wire bond viasINVENSAS LLC·Filed 2021·Granted Aug 22, 2023·0 cites·8 claims
- 2978US9252122B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2013·Granted Feb 2, 2016·2 cites·15 claims
- 3077US10593643B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2018·Granted Mar 17, 2020·1 cites·14 claims
- 3175US11189595B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 3273US8299626B2Microelectronic packageMOHAMMED ILYAS·Filed 2007·Granted Oct 30, 2012·5 cites·4 claims
- 3372US12494453B2Package-on-package assembly with wire bonds to encapsulation surfaceADEIA SEMICONDUCTOR SOLUTIONS LLC·Filed 2023·Granted Dec 9, 2025·0 cites·16 claims
- 3472US10833044B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2020·Granted Nov 10, 2020·0 cites·18 claims
- 3570US9691731B2Package-on-package assembly with wire bonds to encapsulation surfaceTESSERA INC·Filed 2015·Granted Jun 27, 2017·1 cites·20 claims
- 3670US9196581B2Flow underfill for microelectronic packagesTESSERA INC·Filed 2014·Granted Nov 24, 2015·2 cites·20 claims
- 3762US10756049B2Package-on-package assembly with wire bond viasINVENSAS CORP·Filed 2017·Granted Aug 25, 2020·0 cites·16 claims
- 3855US9984901B2Method for making a microelectronic assembly having conductive elementsTESSERA INC·Filed 2015·Granted May 29, 2018·0 cites·19 claims
- 3954US8981579B2Impedance controlled packages with metal sheet or 2-layer rdlTESSERA INC·Filed 2014·Granted Mar 17, 2015·0 cites·19 claims
- 4049US9349672B2Microelectronic packageTESSERA INC·Filed 2012·Granted May 24, 2016·0 cites·21 claims
- 4144US9136197B2Impedence controlled packages with metal sheet or 2-layer RDLHABA BELGACEM·Filed 2012·Granted Sep 15, 2015·0 cites·35 claims
- 4244US2008185705A1Microelectronic packages and methods thereforTESSERA INC·Filed 2007·Application pending·0 cites
- 4341US2006223227A1Molding method for foldover packageTESSERA INC·Filed 2005·Application pending·0 cites
- 4439US2008156518A1Alignment and cutting of microelectronic substratesTESSERA INC·Filed 2007·Application pending·0 cites
- 4538US2005150813A1Foldover packages and manufacturing and test methods thereforTESSERA INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →