Inventor · disambiguated record
Shih-Feng Shao
Also filed as: SHAO SHIH-FENG
6 granted patents·11 pending applications·32 citations·filing 2004–2022
78Inventor score
Top patents by PatentIndex Score
17 records- 0170US7008821B1Method of forming a wafer backside interconnecting wireTOUCH MICRO SYSTEM TECH·Filed 2004·Granted Mar 7, 2006·21 cites·20 claims
- 0269US7598125B2Method for wafer level packaging and fabricating cap structuresTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Oct 6, 2009·5 cites·13 claims
- 0365US7192842B2Method for bonding wafersTOUCH MICRO SYSTEM TECH·Filed 2005·Granted Mar 20, 2007·3 cites·12 claims
- 0460US7510947B2Method for wafer level packaging and fabricating cap structuresTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Mar 31, 2009·2 cites·25 claims
- 0559US8912555B2Semiconductor light-emitting devicePHOSTEK INC·Filed 2013·Granted Dec 16, 2014·1 cites·14 claims
- 0645US2022406976A1Method and Apparatus for LED Display Optical BlendingSCT LTD·Filed 2022·Application pending·0 cites
- 0740US7622334B2Wafer-level packaging cutting method capable of protecting contact padsTOUCH MICRO SYSTEM TECH·Filed 2008·Granted Nov 24, 2009·0 cites·15 claims
- 0839US2006276006A1Method of segmenting a waferYANG CHEN-HSIUNG·Filed 2005·Application pending·0 cites
- 0937US2013264588A1Compact led packageLIU HENG·Filed 2012·Application pending·0 cites
- 1037US2013105825A1Light emitting diode arrayLIU HENG·Filed 2012·Application pending·0 cites
- 1135US2005215029A1Method for fixing wafer used in manufacturing procedureWALSIN LIHWA CORP·Filed 2004·Application pending·0 cites
- 1234US2006030130A1Method of dicing a waferSHAO SHIH-FENG·Filed 2004·Application pending·0 cites
- 1334US2014055049A1Illuminating devicePHOSTEK INC·Filed 2013·Application pending·0 cites
- 1434US2006030120A1Method of performing double-sided processes upon a waferSHAO SHIH-FENG·Filed 2004·Application pending·0 cites
- 1533US2007077676A1Method of fabricating pressure sensorSHAO SHIH-FENG·Filed 2006·Application pending·0 cites
- 1632US2012056228A1Led chip modules, method for packaging the led chip modules, and moving fixture thereofHORNG RAY-HUA·Filed 2011·Application pending·0 cites
- 1728US2013056774A1Lens, package and packaging method for semiconductor light-emitting deviceHONG JHIH-SIN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →