Inventor · disambiguated record
Pietro Corona
Also filed as: CORONA PIETRO
23 granted patents·2 pending applications·407 citations·filing 2000–2012
96Inventor score
Files withST MICROELECTRONICS SRL19BARLOCCHI GABRIELE2VILLA FLAVIO FRANCESCO2CORONA PIETRO1VILLA FLAVIO1
Top patents by PatentIndex Score
25 records- 0197US8173513B2Method for manufacturing a semiconductor pressure sensorVILLA FLAVIO FRANCESCO·Filed 2008·Granted May 8, 2012·48 cites·20 claims
- 0296US7763487B2Integrated differential pressure sensor and manufacturing process thereofST MICROELECTRONICS SRL·Filed 2006·Granted Jul 27, 2010·42 cites·12 claims
- 0394US8008738B2Integrated differential pressure sensorST MICROELECTRONICS SRL·Filed 2010·Granted Aug 30, 2011·18 cites·16 claims
- 0493US7678600B2Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrateST MICROELECTRONICS SRL·Filed 2008·Granted Mar 16, 2010·24 cites·30 claims
- 0593US7452713B2Process for manufacturing a microfluidic device with buried channelsST MICROELECTRONICS SRL·Filed 2005·Granted Nov 18, 2008·39 cites·18 claims
- 0692US7294536B2Process for manufacturing an SOI wafer by annealing and oxidation of buried channelsST MICROELECTRONICS SRL·Filed 2002·Granted Nov 13, 2007·45 cites·27 claims
- 0789US6376291B1Process for manufacturing buried channels and cavities in semiconductor material wafersST MICROELECTRONICS SRL·Filed 2000·Granted Apr 23, 2002·56 cites·20 claims
- 0886US8334188B2Process for manufacturing a wafer by annealing of buried channelsVILLA FLAVIO·Filed 2010·Granted Dec 18, 2012·7 cites·17 claims
- 0986US7846811B2Process for manufacturing a high-quality SOI waferST MICROELECTRONICS SRL·Filed 2006·Granted Dec 7, 2010·11 cites·30 claims
- 1085US8575710B2Capacitive semiconductor pressure sensorVILLA FLAVIO FRANCESCO·Filed 2012·Granted Nov 5, 2013·7 cites·19 claims
- 1185US7811848B2Method for forming buried cavities within a semiconductor body, and semiconductor body thus madeST MICROELECTRONICS SRL·Filed 2006·Granted Oct 12, 2010·12 cites·17 claims
- 1282US7754578B2Process for manufacturing a wafer by annealing of buried channelsST MICROELECTRONICS SRL·Filed 2007·Granted Jul 13, 2010·5 cites·12 claims
- 1381US8344466B2Process for manufacturing MEMS devices having buried cavities and MEMS device obtained therebyST MICROELECTRONICS SRL·Filed 2010·Granted Jan 1, 2013·5 cites·20 claims
- 1476US7071073B2Process for manufacturing low-cost and high-quality SOI substratesST MICROELECTRONICS SRL·Filed 2002·Granted Jul 4, 2006·18 cites·35 claims
- 1576US6992367B2Process for forming a buried cavity in a semiconductor material wafer and a buried cavityST MICROELECTRONICS SRL·Filed 2003·Granted Jan 31, 2006·18 cites·12 claims
- 1676US6362070B1Process for manufacturing a SOI wafer with buried oxide regions without cuspsST MICROELECTRONICS SRL·Filed 2000·Granted Mar 26, 2002·23 cites·20 claims
- 1774US6693039B2Process for forming a buried cavity in a semiconductor material wafer and a buried cavityST MICROELECTRONICS SRL·Filed 2001·Granted Feb 17, 2004·17 cites·17 claims
- 1872US7906406B2Process for manufacturing a semiconductor wafer having SOI-insulated wells and semiconductor wafer thereby manufacturedST MICROELECTRONICS SRL·Filed 2007·Granted Mar 15, 2011·4 cites·27 claims
- 1965US9162876B2Process for manufacturing a membrane microelectromechanical device, and membrane microelectromechanical deviceCORONA PIETRO·Filed 2012·Granted Oct 20, 2015·2 cites·20 claims
- 2062US8420428B2Method for forming buried cavities within a semiconductor body, and semiconductor body thus madeBARLOCCHI GABRIELE·Filed 2010·Granted Apr 16, 2013·1 cites·23 claims
- 2156US7871894B2Process for manufacturing thick suspended structures of semiconductor materialST MICROELECTRONICS SRL·Filed 2006·Granted Jan 18, 2011·1 cites·26 claims
- 2255US2013200484A1Process for manufacturing a wafer by annealing of buried channelsST MICROELECTRONICS SRL·Filed 2012·Application pending·0 cites
- 2353US6759132B2Method for the manufacture of electromagnetic radiation reflecting devicesST MICROELECTRONICS SRL·Filed 2002·Granted Jul 6, 2004·4 cites·6 claims
- 2445US9105690B2Process for manufacturing a semiconductor wafer having SOI-insulated wells and semiconductor wafer thereby manufacturedBARLOCCHI GABRIELE·Filed 2011·Granted Aug 11, 2015·0 cites·21 claims
- 2541US2005208696A1Method for manufacturing a semiconductor pressure sensorST MICROELECTRONICS SRL·Filed 2005·Application pending·0 cites
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