Inventor · disambiguated record
Akira Susaki
Also filed as: SUSAKI AKIRA
7 granted patents·11 pending applications·30 citations·filing 1996–2015
78Inventor score
Top patents by PatentIndex Score
18 records- 0158US5746178AThrottle valve control system obtaining continuous sensor output and throttle valve control method thereofHITACHI LTD·Filed 1996·Granted May 5, 1998·20 cites·12 claims
- 0257US7157370B2Semiconductor device and method for manufacturing the sameEBARA CORP·Filed 2004·Granted Jan 2, 2007·8 cites·17 claims
- 0351US8357284B2Method for forming metal filmEBARA CORP·Filed 2010·Granted Jan 22, 2013·0 cites·7 claims
- 0448US7413983B2Plating method including pretreatment of a surface of a base metalEBARA CORP·Filed 2004·Granted Aug 19, 2008·2 cites·20 claims
- 0547US9633898B2Etching liquid, etching method, and method of manufacturing solder bumpEBARA CORP·Filed 2015·Granted Apr 25, 2017·0 cites·5 claims
- 0646US7947156B2Substrate processing apparatus and substrate processing methodEBARA CORP·Filed 2007·Granted May 24, 2011·0 cites·17 claims
- 0746US2010032315A1Electrolytic processing apparatus and electrolytic processing methodMINE JUNKO·Filed 2009·Application pending·0 cites
- 0845US2009020434A1Substrate processing method and substrate processing apparatusSUSAKI AKIRA·Filed 2008·Application pending·0 cites
- 0943US2016130702A1Method of operating an electroless plating apparatusEBARA CORP·Filed 2015·Application pending·0 cites
- 1042US2015267302A1Electroless plating methodEBARA CORP·Filed 2015·Application pending·0 cites
- 1142US2007251088A1Substrate processing method and apparatusSUSAKI AKIRA·Filed 2007·Application pending·0 cites
- 1242US2015191830A1Etching liquid, etching method, and method of manufacturing solder bumpEBARA CORP·Filed 2015·Application pending·0 cites
- 1342US2014299476A1Electroplating methodEBARA CORP·Filed 2014·Application pending·0 cites
- 1440US2008047583A1Substrate Processing Method and ApparatusFUKUNAGA AKIRA·Filed 2005·Application pending·0 cites
- 1539US8205625B2Apparatus and method for surface treatment of substrate, and substrate processing apparatus and methodTATEISHI HIDEKI·Filed 2007·Granted Jun 26, 2012·0 cites·5 claims
- 1639US2007289604A1Substrate Processing ApparatusFUKUNAGA YUKIO·Filed 2005·Application pending·0 cites
- 1738US2005048768A1Apparatus and method for forming interconnectsFiled 2004·Application pending·0 cites
- 1835US2010097607A1Film Thickness Measuring Method and Substrate Processing ApparatusSUSAKI AKIRA·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →