Inventor · disambiguated record
Yuki Yagyu
Also filed as: YAGYU YUKI
9 granted patents·1 pending application·18 citations·filing 2015–2020
81Inventor score
Top patents by PatentIndex Score
10 records- 0187US10680360B2Press-fit terminal and electronic device including press-fit terminalDENSO CORP·Filed 2019·Granted Jun 9, 2020·6 cites·7 claims
- 0286US9293436B2Bonding wire to bonding padRENESAS ELECTRONICS CORP·Filed 2015·Granted Mar 22, 2016·5 cites·9 claims
- 0382US11128069B2Electronic device and press-fit terminalDENSO CORP·Filed 2020·Granted Sep 21, 2021·2 cites·6 claims
- 0476US9972598B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted May 15, 2018·3 cites·19 claims
- 0570US10128130B2Method for manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 13, 2018·2 cites·19 claims
- 0647US11322859B2Electronic device and insulation-displacement terminalDENSO CORP·Filed 2020·Granted May 3, 2022·0 cites·10 claims
- 0745US2016197050A1Manufacturing method of semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 0840US10535931B2Wire connection deviceDENSO CORP·Filed 2018·Granted Jan 14, 2020·0 cites·7 claims
- 0940US10381318B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Aug 13, 2019·0 cites·20 claims
- 1040US10347604B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 9, 2019·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →