Inventor · disambiguated record
Yi-Ping Pan
Also filed as: PAN YI · PAN YI-PING
7 granted patents·16 pending applications·15 citations·filing 2003–2025
76Inventor score
Files withAAC TECHNOLOGIES PTE LTD10TAIWAN SEMICONDUCTOR MFG CO LTD6SEH AMERICA INC2ABBOTT LAB1Gao hong-jun1
Top patents by PatentIndex Score
23 records- 0176US12243890B2Semiconductor device structure and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 0276US2025160022A1Semiconductor device structure and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0373US11227887B2Semiconductor device structure and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 18, 2022·0 cites·20 claims
- 0471US10475835B2Semiconductor device structure and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 12, 2019·1 cites·19 claims
- 0565US6733368B1Method for lapping a waferSEH AMERICA INC·Filed 2003·Granted May 11, 2004·13 cites·21 claims
- 0663US7932264B2Sinomenine derivatives and preparation and uses thereofNATUREMED GROUP CORP·Filed 2006·Granted Apr 26, 2011·1 cites·8 claims
- 0741US10204959B2Semiconductor image sensing device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 12, 2019·0 cites·20 claims
- 0840US2011201060A1Process for the preparation of scyllo-inositolABBOTT LAB·Filed 2011·Application pending·0 cites
- 0938US9721983B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 1, 2017·0 cites·20 claims
- 1035US2019157574A1Phosphorescence Device Containing Heterocyclic Phosphate Metal ComplexesAAC TECHNOLOGIES PTE LTD·Filed 2018·Application pending·0 cites
- 1135US2006063388A1Method for using a water vapor treatment to reduce surface charge after metal etchingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 1234US2004157461A1Method for fabricating a wafer including dry etching the edge of the waferSEH AMERICA INC·Filed 2003·Application pending·0 cites
- 1334US2011086756A1Method for preparing silicon intercalated monolayer grapheneGao hong-jun·Filed 2010·Application pending·0 cites
- 1431US2017294600A1Iridium complex, method for manufacturing same, and organic light-emitting devices using sameAAC TECHNOLOGIES PTE LTD·Filed 2017·Application pending·0 cites
- 1531US2017294602A1Iridium complex, method for manufacturing same, and organic light-emitting devices using sameAAC TECHNOLOGIES PTE LTD·Filed 2017·Application pending·0 cites
- 1631US2017294599A1Iridium complex, method for manufacturing same, and organic light-emitting devices using sameAAC TECHNOLOGIES PTE LTD·Filed 2017·Application pending·0 cites
- 1731US2017294604A1Iridium complex, method for manufacturing same, and organic light-emitting devices using sameAAC TECHNOLOGIES PTE LTD·Filed 2017·Application pending·0 cites
- 1831US2017294605A1Iridium complex, method for manufacturing same, and organic light-emitting devices using sameAAC TECHNOLOGIES PTE LTD·Filed 2017·Application pending·0 cites
- 1931US2017294603A1Iridium complex, method for manufacturing same, and organic light-emitting devices using sameAAC TECHNOLOGIES PTE LTD·Filed 2017·Application pending·0 cites
- 2031US2017294598A1Iridium complex, method for manufacturing same, and organic light-emitting devices using sameAAC TECHNOLOGIES PTE LTD·Filed 2017·Application pending·0 cites
- 2131US2017294606A1Iridium complex, method for manufacturing same, and organic light-emitting devices using sameAAC TECHNOLOGIES PTE LTD·Filed 2017·Application pending·0 cites
- 2231US2017294601A1Iridium complex, method for manufacturing same, and organic light-emitting devices using sameAAC TECHNOLOGIES PTE LTD·Filed 2017·Application pending·0 cites
- 2330US2005061775A1Novel design to eliminate wafer stickingFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →