Inventor · disambiguated record
Yuji Nakata
Also filed as: NAKATA YUJI
14 granted patents·4 pending applications·406 citations·filing 1983–2015
93Inventor score
Top patents by PatentIndex Score
18 records- 0195US5538394ACooled turbine blade for a gas turbineTOSHIBA KK·Filed 1994·Granted Jul 23, 1996·110 cites·8 claims
- 0292US5624231ACooled turbine blade for a gas turbineTOSHIBA KK·Filed 1994·Granted Apr 29, 1997·112 cites·6 claims
- 0387US6663708B1Silicon wafer, and manufacturing method and heat treatment method of the sameMITSUBISHI MATERIAL SILICON·Filed 2000·Granted Dec 16, 2003·42 cites·1 claims
- 0485US7037548B2Soybean embryo fat/oil and process for producing soybean material with high embryo concentrationAJINOMOTO KK·Filed 2004·Granted May 2, 2006·17 cites·21 claims
- 0585US6814998B1Soybean embryo fat/oil and process for producing soybean material with high embryo concentrationAJINOMOTO KK·Filed 2000·Granted Nov 9, 2004·20 cites·21 claims
- 0675US9701547B2Ion exchanger, water treatment device provided with same, and hot water supply devicePANASONIC IP MAN CO LTD·Filed 2013·Granted Jul 11, 2017·2 cites·9 claims
- 0768US6105362ACombined cycle power plant with gas turbine cooling systemTOSHIBA KK·Filed 1998·Granted Aug 22, 2000·45 cites·8 claims
- 0867US5778657ACombined cycle power plantTOSHIBA KK·Filed 1996·Granted Jul 14, 1998·35 cites·16 claims
- 0955US4573872AHigh temperature heat resistant structureTOKYO SHIBAURA ELECTRIC CO·Filed 1983·Granted Mar 4, 1986·13 cites·5 claims
- 1047US7678999B2Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistanceTANAKA ELECTRONICS IND·Filed 2006·Granted Mar 16, 2010·0 cites·7 claims
- 1147US2014017132A1Decontamination solution spray devicePANASONIC HEALTHCARE CO LTD·Filed 2013·Application pending·0 cites
- 1245US7857189B2Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistanceTANAKA ELECTRONICS IND·Filed 2006·Granted Dec 28, 2010·0 cites·2 claims
- 1345US2002081365A1Method for the production of germ-enriched soybean materialAJINOMOTO KK·Filed 2001·Application pending·0 cites
- 1440US10392273B2Ion exchange membrane, ion exchange membrane laminated body provided with ion exchange membrane, electrochemical cell provided with ion exchange membrane laminated body, and water treatment apparatus provided with electrochemical cellPANASONIC IP MAN CO LTD·Filed 2015·Granted Aug 27, 2019·0 cites·9 claims
- 1539US2004025983A1Method of manufacturing siliconFiled 2003·Application pending·0 cites
- 1639US2009232695A1Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, high resin flowability resistance, and low specific resistanceMAKI KAZUNARI·Filed 2006·Application pending·0 cites
- 1735US6038850ACombined cycle power plantTOSHIBA KK·Filed 1998·Granted Mar 21, 2000·6 cites·12 claims
- 1831US6000213ACombined cycle power plantTOSHIBA KK·Filed 1998·Granted Dec 14, 1999·4 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →