Inventor · disambiguated record
Dong-Hyun Jang
Also filed as: JANG DONG-HYUN
10 granted patents·39 citations·filing 2006–2020
86Inventor score
Top patents by PatentIndex Score
10 records- 0192US7572673B2Wafer level package having a stress relief spacer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 11, 2009·18 cites·14 claims
- 0285US8426252B2Wafer level package having a stress relief spacer and manufacturing method thereofCHUNG HYUN-SOO·Filed 2012·Granted Apr 23, 2013·5 cites·16 claims
- 0381US7838992B2Wafer level package having a stress relief spacer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 23, 2010·6 cites·22 claims
- 0477US8415804B2Semiconductor chip, method of fabricating the same, and stack module and memory card including the sameLEE HO-JIN·Filed 2009·Granted Apr 9, 2013·7 cites·28 claims
- 0568US12319223B2Driver seat airbag device for vehicle and method for manufacturing sameAUTOLIV DEV·Filed 2020·Granted Jun 3, 2025·1 cites·21 claims
- 0666US8232644B2Wafer level package having a stress relief spacer and manufacturing method thereofCHUNG HYUN-SOO·Filed 2012·Granted Jul 31, 2012·1 cites·29 claims
- 0766US8120177B2Wafer level package having a stress relief spacer and manufacturing method thereofCHUNG HYUN-SOO·Filed 2010·Granted Feb 21, 2012·1 cites·28 claims
- 0853US12115261B2Block copolymer comprising hydrophilic first block, hydrophobic second block, and functional group capable of specifically binding to thiolGI CELL INC·Filed 2019·Granted Oct 15, 2024·0 cites·18 claims
- 0952US11760296B2Vehicular airbag deviceAUTOLIV DEV·Filed 2019·Granted Sep 19, 2023·0 cites·13 claims
- 1027US12108674B2Parallel thermoelectric moduleMI SEOJIN INC·Filed 2018·Granted Oct 1, 2024·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →