Inventor · disambiguated record
Ivor G. Barber
Also filed as: BARBER IVOR · BARBER IVOR G
21 granted patents·2 pending applications·744 citations·filing 1995–2020
96Inventor score
Top patents by PatentIndex Score
23 records- 0197US10510721B2Molded chip combinationBHAGAVAT MILIND S·Filed 2017·Granted Dec 17, 2019·32 cites·20 claims
- 0296US10529645B2Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal managementXILINX INC·Filed 2017·Granted Jan 7, 2020·26 cites·20 claims
- 0396US5545923ASemiconductor device assembly with minimized bond finger connectionsLSI LOGIC CORP·Filed 1995·Granted Aug 13, 1996·207 cites·15 claims
- 0495US10043730B2Stacked silicon package assembly having an enhanced lidXILINX INC·Filed 2015·Granted Aug 7, 2018·19 cites·19 claims
- 0594US5801072AMethod of packaging integrated circuitsLSI LOGIC CORP·Filed 1996·Granted Sep 1, 1998·180 cites·14 claims
- 0692US5723369AMethod of flip chip assemblyLSI LOGIC CORP·Filed 1996·Granted Mar 3, 1998·140 cites·12 claims
- 0789US6590292B1Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfillLSI LOGIC CORP·Filed 2001·Granted Jul 8, 2003·49 cites·9 claims
- 0875US10319606B1Chip package assembly with enhanced interconnects and method for fabricating the sameXILINX INC·Filed 2017·Granted Jun 11, 2019·2 cites·20 claims
- 0973US5741726ASemiconductor device assembly with minimized bond finger connectionsLSI LOGIC CORP·Filed 1996·Granted Apr 21, 1998·32 cites·19 claims
- 1067US6673708B1Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfillLSI LOGIC CORP·Filed 2003·Granted Jan 6, 2004·11 cites·15 claims
- 1164US7829424B2Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designsLSI CORP·Filed 2008·Granted Nov 9, 2010·2 cites·3 claims
- 1260US11393697B2Semiconductor chip getteringADVANCED MICRO DEVICES INC·Filed 2020·Granted Jul 19, 2022·0 cites·20 claims
- 1359US7508062B2Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designsLSI CORP·Filed 2005·Granted Mar 24, 2009·1 cites·9 claims
- 1459US5700723AMethod of packaging an integrated circuitLSI LOGIC CORP·Filed 1996·Granted Dec 23, 1997·24 cites·14 claims
- 1557US10527670B2Testing system for lid-less integrated circuit packagesXILINX INC·Filed 2017·Granted Jan 7, 2020·0 cites·20 claims
- 1652US10825692B2Semiconductor chip getteringADVANCED MICRO DEVICES INC·Filed 2018·Granted Nov 3, 2020·0 cites·18 claims
- 1751US6943446B2Via construction for structural supportLSI LOGIC CORP·Filed 2002·Granted Sep 13, 2005·4 cites·4 claims
- 1847US10096502B2Method and apparatus for assembling and testing a multi-integrated circuit packageXILINX INC·Filed 2016·Granted Oct 9, 2018·0 cites·16 claims
- 1946US7173328B2Integrated circuit package and method having wire-bonded intra-die electrical connectionsLSI LOGIC CORP·Filed 2004·Granted Feb 6, 2007·2 cites·6 claims
- 2042US5604161ASemiconductor device assembly with minimized bond finger connectionsLSI LOGIC CORP·Filed 1995·Granted Feb 18, 1997·7 cites·18 claims
- 2142US2009285261A1Integrated Circuit System MonitorLSI CORP·Filed 2008·Application pending·0 cites
- 2242US2014191403A1Multi-die semiconductor package and method of manufacturing thereofLSI CORP·Filed 2013·Application pending·0 cites
- 2340US5895968ASemiconductor device assembly with minimized bond finger connectionsFiled 1997·Granted Apr 20, 1999·6 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Ivor G. Barber files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →