Inventor · disambiguated record
Ji Hwan Shin
Also filed as: SHIN JI H · SHIN JI HWAN
8 granted patents·11 pending applications·63 citations·filing 2001–2021
83Inventor score
Top patents by PatentIndex Score
19 records- 0181US6756860B2Dual band couplerSAMSUNG ELECTRO MECH·Filed 2002·Granted Jun 29, 2004·20 cites·20 claims
- 0281US6642809B2Multi-layer chip directional couplerSAMSUNG ELECTRO MECH·Filed 2001·Granted Nov 4, 2003·19 cites·4 claims
- 0374US7926154B2Method of manufacturing multi-layer ceramic condenserSAMSUNG ELECTRO MECH·Filed 2008·Granted Apr 19, 2011·8 cites·5 claims
- 0466US12308155B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted May 20, 2025·0 cites·20 claims
- 0566US6627966B2Method and device for sealing ceramic package of saw filterSAMSUNG ELECTRO MECH·Filed 2001·Granted Sep 30, 2003·15 cites·19 claims
- 0658US9188607B2Substrate and method for manufacturing the same, and probe cardHWANG GYU MAN·Filed 2012·Granted Nov 17, 2015·1 cites·11 claims
- 0758US2014193656A1Method of manufacturing fine metal powder and fine metal powder manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0852US7857529B2Shutter deviceSAMSUNG ELECTRO MECH·Filed 2008·Granted Dec 28, 2010·0 cites·43 claims
- 0950US9681551B2Low temperature co-fired ceramic substrate with embeded capacitorsSAMSUNG ELECTRO MECH·Filed 2014·Granted Jun 13, 2017·0 cites·12 claims
- 1049US2012135262A1Method of manufacturing fine metal powder and fine metal powder manufactured by using the sameWI SUNG KWON·Filed 2011·Application pending·0 cites
- 1149US2022199313A1Coil componentSAMSUNG ELECTRO MECH·Filed 2021·Application pending·0 cites
- 1243US2012100036A1Method of manufacturing ultra fine metal powder and ultra fine metal powder manufactured by the sameSHIN JI HWAN·Filed 2011·Application pending·0 cites
- 1342US2006180899A1Semiconductive chip device having insulating coating layer and method of manfacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 1442US2012169447A1Nanocomposite powder for inner electrode of multilayer ceramic electronic device and fabricating method thereofYANG JU HWAN·Filed 2011·Application pending·0 cites
- 1541US2011294073A1Preparing method of metal powder and method of manufacturing inner electrode of multilayer ceramic capacitor using the sameSHIN JI HWAN·Filed 2010·Application pending·0 cites
- 1641US2012126460A1Apparatus and method for manufacturing board for production of metal flakeSHIN JI HWAN·Filed 2011·Application pending·0 cites
- 1738US2015028912A1Board for probe card, method of manufacturing the same, and probe cardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1835US2011181314A1Member for adjusting horizontality, and probe card with the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1934US2011156740A1Probe cardSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →