Inventor · disambiguated record
Wei Chen
Also filed as: CHEN WEI · CHEN WEI-TONG
8 granted patents·1 pending application·1 citations·filing 2013–2022
72Inventor score
Top patents by PatentIndex Score
9 records- 0157US11903180B2Method of manufacturing semiconductor device having word line structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Feb 13, 2024·0 cites·8 claims
- 0255US9972595B2Bonding wire for high-speed signal lineTANAKA ELECTRONICS IND·Filed 2013·Granted May 15, 2018·1 cites·9 claims
- 0354US12224328B2Semiconductor device having word line structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Feb 11, 2025·0 cites·17 claims
- 0454US11895820B2Method of manufacturing memory device having word line with improved adhesion between work function member and conductive layerNANYA TECHNOLOGY CORP·Filed 2022·Granted Feb 6, 2024·0 cites·6 claims
- 0549US12237293B2Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereofTANAKA ELECTRONICS IND·Filed 2021·Granted Feb 25, 2025·0 cites·13 claims
- 0649US11937420B2Memory device having word line with improved adhesion between work function member and conductive layerNANYA TECHNOLOGY CORP·Filed 2022·Granted Mar 19, 2024·0 cites·8 claims
- 0742US10195697B2Palladium (Pd)-coated copper wire for ball bondingTANAKA ELECTRONICS IND·Filed 2016·Granted Feb 5, 2019·0 cites·7 claims
- 0837US9362249B2Silver—gold alloy bonding wireTANAKA ELECTRONICS IND·Filed 2015·Granted Jun 7, 2016·0 cites·5 claims
- 0931US2017125135A1Noble metal-coated copper wire for ball bondingTANAKA ELECTRONICS IND·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →