Inventor · disambiguated record
Hiroshi Kudo
Also filed as: KUDO HIROSHI
57 granted patents·10 pending applications·1,034 citations·filing 1979–2025
98Inventor score
Files withDAINIPPON PRINTING CO LTD20FUJITSU LTD13FUJI INDUSTRIES CO LTD6FUJITSU SEMICONDUCTOR LTD5CANON KK4
Top patents by PatentIndex Score
67 records- 0195US5602060AProcess for the production of semiconductor devicesFUJITSU LTD·Filed 1996·Granted Feb 11, 1997·479 cites·10 claims
- 0294US10121748B2Line structure and a method for producing the sameDAINIPPON PRINTING CO LTD·Filed 2017·Granted Nov 6, 2018·7 cites·5 claims
- 0393US10586768B2Line structure and a method for producing the sameDAINIPPON PRINTING CO LTD·Filed 2018·Granted Mar 10, 2020·5 cites·15 claims
- 0493US9735108B2Line structure and a method for producing the sameDAINIPPON PRINTING CO LTD·Filed 2015·Granted Aug 15, 2017·7 cites·27 claims
- 0587US12255145B2Multi-layer line structureDAINIPPON PRINTING CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·10 claims
- 0685US2025349635A1Through electrode substrate, manufacturing method thereof and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2025·Application pending·0 cites
- 0784US2025210524A1Multi-layer line structureDAINIPPON PRINTING CO LTD·Filed 2025·Application pending·0 cites
- 0882US10957592B2Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2017·Granted Mar 23, 2021·2 cites·13 claims
- 0982US8836126B2Semiconductor device having insulating layers containing oxygen and a barrier layer containing manganeseOCHIMIZU HIROSATO·Filed 2009·Granted Sep 16, 2014·11 cites·3 claims
- 1080US11195768B2Through electrode substrate, manufacturing method thereof and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2017·Granted Dec 7, 2021·2 cites·23 claims
- 1180US2025014979A1Through electrode substrate and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 1278US5495255AFM radar systemHONDA MOTOR CO LTD·Filed 1993·Granted Feb 27, 1996·51 cites·16 claims
- 1377US11862564B2Multi-layer line structure and method for manufacturing thereofDAINIPPON PRINTING CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·25 claims
- 1477US6420261B2Semiconductor device manufacturing methodFUJITSU LTD·Filed 1999·Granted Jul 16, 2002·52 cites·25 claims
- 1576US11810820B2Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·15 claims
- 1675US6037274AMethod for forming insulating filmFUJITSU LTD·Filed 1996·Granted Mar 14, 2000·46 cites·3 claims
- 1774US5614909AFM radar systemHONDA MOTOR CO LTD·Filed 1995·Granted Mar 25, 1997·36 cites·7 claims
- 1873US11217530B2Line structure and a method for producing the sameDAINIPPON PRINTING CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·17 claims
- 1973US11069618B2Line structure and a method for producing the sameDAINIPPON PRINTING CO LTD·Filed 2020·Granted Jul 20, 2021·0 cites·2 claims
- 2073US5780874AProcess for forming fluorinated resin or amorphous carbon layer and devices containing sameFUJITSU LTD·Filed 1996·Granted Jul 14, 1998·34 cites·2 claims
- 2173US2025140703A1Through electrode substrate, electronic unit, method for manufacturing through electrode substrate, and method for manufacturing electronic unitDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 2272US12394680B2Through electrode substrate, manufacturing method thereof and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2021·Granted Aug 19, 2025·0 cites·14 claims
- 2372US12119293B2Through electrode substrate and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2021·Granted Oct 15, 2024·0 cites·15 claims
- 2471US11373906B2Through electrode substrate, method of manufacturing through electrode substrate, and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2021·Granted Jun 28, 2022·0 cites·12 claims
- 2571US7915733B2Semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Mar 29, 2011·4 cites·15 claims
- 2670USD580041SRange hoodFUJI INDUSTRIES CO LTD·Filed 2007·Granted Nov 4, 2008·14 cites·1 claims
- 2770US6048786AProcess for forming fluorinated resin or amorphous carbon layer and devices containing sameFUJITSU LTD·Filed 1998·Granted Apr 11, 2000·21 cites·12 claims
- 2869US7928476B2Semiconductor device and method of manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Apr 19, 2011·3 cites·5 claims
- 2969US7041586B2Semiconductor device having a multilayer interconnection structureFUJITSU LTD·Filed 2002·Granted May 9, 2006·13 cites·14 claims
- 3068US7064038B2Semiconductor device and method for fabricating the sameFUJITSU LTD·Filed 2004·Granted Jun 20, 2006·12 cites·33 claims
- 3166US12500405B2Power distribution deviceYAZAKI CORP·Filed 2024·Granted Dec 16, 2025·0 cites·4 claims
- 3266USD580540SRange hoodFUJI INDUSTRIES CO LTD·Filed 2008·Granted Nov 11, 2008·12 cites·1 claims
- 3366US4305910ACatalytic reaction for reduction of nitrogen oxideMITSUI SHIPBUILDING ENG·Filed 1981·Granted Dec 15, 1981·26 cites·1 claims
- 3463USD484231SBlower unit for a range hoodFUJI INDUSTRIES CO LTD·Filed 2003·Granted Dec 23, 2003·12 cites·1 claims
- 3563US5896104AFM radar systemHONDA MOTOR CO LTD·Filed 1997·Granted Apr 20, 1999·35 cites·13 claims
- 3662US7679144B2Semiconductor device and method for manufacturing the sameFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted Mar 16, 2010·2 cites·14 claims
- 3761US12218068B2Through electrode substrate, electronic unit, method for manufacturing through electrode substrate, and method for manufacturing electronic unitDAINIPPON PRINTING CO LTD·Filed 2020·Granted Feb 4, 2025·0 cites·20 claims
- 3860US4256439APower control system for multiple pumpsJAPAN STEEL WORKS LTD·Filed 1979·Granted Mar 17, 1981·14 cites·11 claims
- 3959USD483846SBlower unitFUJI INDUSTRIES CO LTD·Filed 2003·Granted Dec 16, 2003·10 cites·1 claims
- 4058US5080048APower blowerKIORITZ CORP·Filed 1991·Granted Jan 14, 1992·16 cites·1 claims
- 4157US11822714B2Electronic device and control method for capturing an image of an eyeCANON KK·Filed 2021·Granted Nov 21, 2023·0 cites·19 claims
- 4257US7163887B2Method for fabricating a semiconductor deviceTOKYO ELECTRON LTD·Filed 2004·Granted Jan 16, 2007·5 cites·22 claims
- 4354US9704740B2Semiconductor device having insulating layers containing oxygen and a barrier layer containing manganeseFUJITSU SEMICONDUCTOR LTD·Filed 2016·Granted Jul 11, 2017·0 cites·7 claims
- 4454US9456124B2Detection device, and image pickup apparatus with the sameCANON KK·Filed 2014·Granted Sep 27, 2016·0 cites·18 claims
- 4554USD565718SRange hoodFUJI INDUSTRIES CO LTD·Filed 2004·Granted Apr 1, 2008·7 cites·1 claims
- 4654US2014353829A1Semiconductor device having insulating layers containing oxygen and a barrier layer containing manganeseFUJITSU SEMICONDUCTOR LTD·Filed 2014·Application pending·0 cites
- 4754US2019259696A1Through electrode substrate and mounting substrateDAINIPPON PRINTING CO LTD·Filed 2017·Application pending·0 cites
- 4853US6417116B2Semiconductor device having a multilayer interconnection structureFUJITSU LTD·Filed 1999·Granted Jul 9, 2002·16 cites·13 claims
- 4953US2021358064A1Patent strategy chart graphic representation method, digital system for assisting in graphic representation of patent strategy chart, patent strategy chart, patent strategy chart generation method, management system, computer program, and patent strategy chart componentKUDO HIROSHI·Filed 2019·Application pending·0 cites
- 5052US2024096808A1Semiconductor package, manufacturing method of semiconductor package, and interposer groupDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →