Through electrode substrate and mounting substrate

Abstract

A through electrode substrate includes a substrate provided with a through hole, a through electrode positioned in the through hole, and a first wiring structure including at least a first wiring layer positioned on a first surface of the substrate, and a second wiring layer positioned on the first wiring layer. The first wiring layer and the second wiring layer respectively have an insulation layer and an electroconductive layer. A first insulation layer of the first wiring layer includes at least an organic layer. At least one wiring layer of the first wiring structure includes an inorganic layer having insulation properties, the inorganic layer being positioned to a first side of the organic layer of the first insulation layer of the first wiring layer.

1 . A through electrode substrate comprising:
 a substrate including a first surface positioned on a first side, and a second surface positioned on a second side opposite to the first side, the substrate being provided with a through hole;   a through electrode positioned in the through hole of the substrate, the through electrode having a first end surface on the first side and a second end surface on the second side; and   a first wiring structure including at least a first wiring layer positioned on the first surface of the substrate, and a second wiring layer positioned on the first wiring layer;   wherein:   the first wiring layer has a first insulation layer provided with a first opening positioned on the first end surface of the through electrode, and a first electroconductive layer connected to the first end surface of the through electrode through the first opening of the first insulation layer;   the second wiring layer has a second insulation layer provided with a second opening positioned on the first electroconductive layer of the first wiring layer, and a second electroconductive layer connected to the first electroconductive layer of the first wiring layer through the second opening of the second insulation layer;   the first insulation layer of the first wiring layer includes at least an organic layer;   at least any one layer selected from the group of the first insulation layer of the first wiring layer, the second insulation layer of the second wiring layer, and a layer of the first wiring structure not included in the first wiring layer and the second wiring layer, includes an inorganic layer having insulation properties; and   the inorganic layer is positioned to the first side of the organic layer of the first insulation layer of the first wiring layer.   
     
     
         2 . The through electrode substrate according to  claim 1 , wherein
 the organic layer of the first insulation layer of the first wiring layer is in contact with the first end surface of the through electrode.   
     
     
         3 . The through electrode substrate according to  claim 1 , wherein
 the second insulation layer of the second wiring layer includes the inorganic layer.   
     
     
         4 . The through electrode substrate according to  claim 3 ,
 the inorganic layer of the second insulation layer of the second wiring layer at least partially covers the first electroconductive layer of the first wiring layer.   
     
     
         5 . The though electrode substrate according to  claim 3 , wherein
 the second insulation layer of the second wiring layer further has an organic layer positioned to the first side of the inorganic layer.   
     
     
         6 . The through electrode substrate according to  claim 3 , wherein:
 the first wiring structure further includes a third wiring layer positioned on the second wiring layer; and   the third wiring layer includes: a third insulation layer including an inorganic layer and an organic layer positioned to the first side of the inorganic layer, the third insulation layer being provided with a third opening positioned on the second electroconductive layer of the second wiring layer; and a third electroconductive layer connected to the second electroconductive layer of the second wiring layer through the third opening of the third insulation layer.   
     
     
         7 . The through electrode substrate according to  claim 3 , wherein:
 the through electrode substrate further comprises a second wiring structure including at least a first wiring layer positioned on the second surface of the substrate, and a second wiring layer positioned on the first wiring layer;   the first wiring layer of the second wiring structure has a first insulation layer provided with a first opening positioned on the second end surface of the through electrode, and a first electroconductive layer connected to the second end surface of the through electrode through the first opening of the first insulation layer;   the second wiring layer of the second wiring structure has a second insulation layer provided with a second opening positioned on the first electroconductive layer of the first wiring layer, and a second electroconductive layer connected to the first electroconductive layer of the first wiring layer through the second opening of the second insulation layer; and   the first insulation layer of the first wiring layer of the second wiring structure includes at least an organic layer.   
     
     
         8 . The through electrode substrate according to  claim 7 , wherein
 the second insulation layer of the second wiring layer of the second wiring structure includes an inorganic layer having insulation properties, and   the inorganic layer of the second insulation layer of the second wiring layer of the second wiring structure at least partially covers the first electroconductive layer of the first wiring layer of the second wiring structure.   
     
     
         9 . The through electrode substrate according to  claim 8 , wherein
 the number of layers of the electroconductive layer included in the second wiring structure is smaller than the number of layers of the electroconductive layer included in the first wiring structure, and   the organic layer of the first wiring layer of the second wiring structure includes a portion that is not covered with the inorganic layer of the second wiring layer of the second wiring structure.   
     
     
         10 . The through electrode substrate according to  claim 9 , wherein
 a ratio of a portion of the organic layer of the first wiring layer of the second wiring structure, which portion is covered with the inorganic layer of the second wiring layer of the second wiring structure, is lower than a ratio of a portion of the organic layer of the first wiring layer of the first wiring structure, which portion is covered with the inorganic layer of the second wiring layer of the first wiring structure.   
     
     
         11 . The through electrode substrate according to  claim 3 , wherein:
 the through electrode substrate further comprises a second wiring structure including at least a first wiring layer positioned on the second surface of the substrate;   the first wiring layer of the second wiring structure has a first insulation layer provided with a first opening positioned on the second end surface of the through electrode, and a first electroconductive layer connected to the second end surface of the through electrode through the first opening of the first insulation layer;   the first insulation layer of the first wiring layer of the second wiring structure includes at least an organic layer; and   the first electroconductive layer and the organic layer of the first wiring layer of the second wiring structure is not covered with an inorganic layer having insulation properties.   
     
     
         12 . The through electrode substrate according to  claim 1 , wherein
 the first insulation layer of the first wiring layer includes the inorganic layer positioned to the first side of the organic layer.   
     
     
         13 . The through electrode substrate according to  claim 12 , wherein
 the inorganic layer of the first insulation layer of the first wiring layer is at least partially in contact with the first electroconductive layer of the first wiring layer from the second side.   
     
     
         14 . The through electrode substrate according to  claim 12 , wherein
 the second insulation layer of the second wiring layer has an organic layer and an inorganic layer positioned to the first side of the organic layer.   
     
     
         15 . The through electrode substrate according to  claim 12 , wherein:
 the first wiring structure further includes a third wiring layer positioned on the second wiring layer; and   the third wiring layer has: a third insulation layer including an organic layer and an inorganic layer positioned to the first side of the organic layer, the third insulation layer being provided with a third opening positioned on the electroconductive layer of the second wiring layer; and a third electroconductive layer connected to the second electroconductive layer of the second wiring layer through the third opening of the third insulation layer.   
     
     
         16 . The through electrode substrate according to  claim 12 , wherein:
 the through electrode substrate further comprises a second wiring structure including at least a first wiring layer positioned on the second surface of the substrate, and a second wiring layer positioned on the first wiring layer;   the first wiring layer of the second wiring structure has a first insulation layer provided with a first opening positioned on the second end surface of the through electrode, and a first electroconductive layer connected to the second end surface of the through electrode through the first opening of the first insulation layer;   the second wiring layer of the second wiring structure has a second insulation layer provided with a second opening positioned on the first electroconductive layer of the first wiring layer, and a second electroconductive layer connected to the first electroconductive layer of the first wiring layer through the second opening of the second insulation layer; and   the first insulation layer of the first wiring layer of the second wiring structure includes at least an organic layer.   
     
     
         17 . The through electrode substrate according to  claim 16 , wherein
 the first insulation layer of the first wiring layer of the second wiring structure further includes an inorganic layer having insulation properties, the inorganic layer being positioned to the second side of the organic layer, and   the inorganic layer of the first insulation layer of the first wiring layer of the second wiring structure is at least partially in contact with the first electroconductive layer of the first wiring layer of the second wiring structure from the first side.   
     
     
         18 . The through electrode substrate according to  claim 17 , wherein
 the number of layers of the electroconductive layer included in the second wiring structure is smaller than the number of layers of the electroconductive layer included in the first wiring structure, and   the organic layer of the first wiring layer of the second wiring structure includes a portion that is not covered with the inorganic layer of the first wiring layer of the second wiring structure.   
     
     
         19 . The through electrode substrate according to  claim 18 , wherein
 a ratio of a portion of the organic layer of the first wiring layer of the second wiring structure, which portion is covered with the inorganic layer of the first wiring layer of the second wiring structure, is lower than a ratio of a portion of the organic layer of the first wiring layer of the first wiring structure, which portion is covered with the inorganic layer of the first wiring layer of the first wiring structure.   
     
     
         20 . The through electrode substrate according to  claim 12 , wherein:
 the through electrode substrate further comprises a second wiring structure including at least a first wiring layer positioned on the second surface of the substrate;   the first wiring layer of the second wiring structure has a first insulation layer provided with a first opening positioned on the second end surface of the through electrode, and a first electroconductive layer connected to the second end surface of the through electrode through the first opening of the first insulation layer;   the first insulation layer of the first wiring layer of the second wiring structure includes at least an organic layer; and   the first electroconductive layer and the organic layer of the first wiring layer of the second wiring structure is not covered with an inorganic layer having insulation properties.   
     
     
         21 . The through electrode substrate according to  claim 1 , wherein
 the organic layer contains at least polyimide, epoxy or acryl.   
     
     
         22 . The through electrode substrate according to  claim 1 , wherein
 the inorganic layer contains at least silicon oxide or silicon nitride.   
     
     
         23 . A mounting substrate comprising:
 a through electrode substrate; and
 an element loaded on the through electrode substrate; 
 wherein: 
 the through electrode substrate comprises:
 a substrate including a first surface positioned on a first side, and a second surface positioned on a second side opposite to the first side, the substrate being provided with a through hole; 
 a through electrode positioned in the through hole of the substrate, the through electrode having a first end surface on the first side and a second end surface on the second side; and 
 a first wiring structure including at least a first wiring layer positioned on the first surface of the substrate, and a second wiring layer positioned on the first wiring layer; 
 
 the first wiring layer has a first insulation layer provided with a first opening positioned on the first end surface of the through electrode, and a first electroconductive layer connected to the first end surface of the through electrode through the first opening of the first insulation layer; 
 the second wiring layer has a second insulation layer provided with a second opening positioned on the first electroconductive layer of the first wiring layer, and a second electroconductive layer connected to the first electroconductive layer of the first wiring layer through the second opening of the second insulation layer; 
 the first insulation layer of the first wiring layer includes at least an organic layer; 
 at least any one layer selected from the group of the first insulation layer of the first wiring layer, the second insulation layer of the second wiring layer, and a layer of the first wiring structure not included in the first wiring layer and the second wiring layer, includes an inorganic layer having insulation properties; and 
 the inorganic layer is positioned to the first side of the organic layer of the first insulation layer of the first wiring layer.