Inventor · disambiguated record
Yoshifumi Takata
Also filed as: TAKATA YOSHIFUMI
16 granted patents·2 pending applications·266 citations·filing 1989–2013
94Inventor score
Top patents by PatentIndex Score
18 records- 0193US6476491B2Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion and method for fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 5, 2002·75 cites·13 claims
- 0287US6448658B2Semiconductor device having improved interconnection-wiring structuresMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 10, 2002·41 cites·6 claims
- 0379US8716122B2Method of manufacturing semiconductor device having surface protective films on bond padRENESAS ELECTRONICS CORP·Filed 2013·Granted May 6, 2014·7 cites·7 claims
- 0472US5313100AMultilayer interconnection structure for a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1992·Granted May 17, 1994·37 cites·11 claims
- 0567US5475267AMultilayer interconnection structure for a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Dec 12, 1995·29 cites·22 claims
- 0664US8390134B2Semiconductor device having surface protective films on bond padHOMMA TAKURO·Filed 2010·Granted Mar 5, 2013·2 cites·8 claims
- 0762US6727170B2Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereofRENESAS TECH CORP·Filed 2001·Granted Apr 27, 2004·11 cites·3 claims
- 0860US6500675B2Manufacturing method of semiconductor device having capacitive elementMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Dec 31, 2002·10 cites·5 claims
- 0951US4962061AMethod for manufacturing a multilayer wiring structure employing metal fillets at step portionsMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Oct 9, 1990·17 cites·9 claims
- 1047US6890857B2Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion, and method for fabricating the sameRENESAS TECH CORP·Filed 2002·Granted May 10, 2005·2 cites·2 claims
- 1145US5442238AInterconnection structure of a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Aug 15, 1995·12 cites·17 claims
- 1243US6278187B1Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Aug 21, 2001·11 cites·8 claims
- 1340US5561084AMethod of making an interconnection structure of a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Oct 1, 1996·8 cites·4 claims
- 1436US5712140AMethod of manufacturing interconnection structure of a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jan 27, 1998·4 cites·7 claims
- 1535US6319812B1Method of manufacturing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 20, 2001·0 cites·7 claims
- 1635US2003109100A1Semiconductor device having capacitive element and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 1735US2002093097A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
- 1829US6777738B2Semiconductor integrated circuitRENESAS TECH CORP·Filed 1999·Granted Aug 17, 2004·0 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when Yoshifumi Takata files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →