Inventor · disambiguated record
Hideo Senoo
Also filed as: SENOO HIDEO
19 granted patents·2 pending applications·668 citations·filing 1994–2009
96Inventor score
Files withLINTEC CORP21
Top patents by PatentIndex Score
21 records- 0194US6544371B2Method of using a transfer tapeLINTEC CORP·Filed 2001·Granted Apr 8, 2003·101 cites·2 claims
- 0292US6919262B2Process for producing semiconductor chipsLINTEC CORP·Filed 2002·Granted Jul 19, 2005·38 cites·1 claims
- 0391US6558975B2Process for producing semiconductor deviceLINTEC CORP·Filed 2001·Granted May 6, 2003·73 cites·6 claims
- 0488US5705016AMethod of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheetLINTEC CORP·Filed 1995·Granted Jan 6, 1998·98 cites·2 claims
- 0585US6656819B1Process for producing semiconductor deviceLINTEC CORP·Filed 2000·Granted Dec 2, 2003·42 cites·1 claims
- 0685US6277481B1Adhesive composition and adhesive sheetLINTEC CORP·Filed 1999·Granted Aug 21, 2001·74 cites·26 claims
- 0778US6765289B2Reinforcement material for silicon wafer and process for producing IC chip using said materialLINTEC CORP·Filed 2001·Granted Jul 20, 2004·27 cites·8 claims
- 0877US7235465B2Process for producing semiconductor chips having a protective film on the back surfaceLINTEC CORP·Filed 2005·Granted Jun 26, 2007·6 cites·1 claims
- 0976US7384676B2Coating composition, hard coat film, and optical diskLINTEC CORP·Filed 2004·Granted Jun 10, 2008·10 cites·8 claims
- 1076US7135224B2Adhesive tapeLINTEC CORP·Filed 2002·Granted Nov 14, 2006·21 cites·2 claims
- 1176US5888606AMethod of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheetLINTEC CORP·Filed 1997·Granted Mar 30, 1999·49 cites·11 claims
- 1274US6444310B1Dicing tape and a method of dicing a semiconductor waferLINTEC CORP·Filed 1999·Granted Sep 3, 2002·45 cites·8 claims
- 1373US7408259B2Sheet to form a protective film for chipsLINTEC CORP·Filed 2005·Granted Aug 5, 2008·4 cites·5 claims
- 1469US7589130B2Coating composition, coating film, method of manufacturing coating film, and optical recording mediumLINTEC CORP·Filed 2005·Granted Sep 15, 2009·1 cites·1 claims
- 1568US6042922AAdhesive sheet for wafer setting and process for producing electronic componentLINTEC CORP·Filed 1998·Granted Mar 28, 2000·37 cites·4 claims
- 1662US2009291248A1Coating composition, coating film, method of manufacturing coating film, and optical recording mediumLINTEC CORP·Filed 2009·Application pending·0 cites
- 1759US7169648B2Process for producing a semiconductor deviceLINTEC CORP·Filed 2004·Granted Jan 30, 2007·8 cites·2 claims
- 1859US6855418B2Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing sameLINTEC CORP·Filed 2002·Granted Feb 15, 2005·8 cites·9 claims
- 1957US6297076B1Process for preparing a semiconductor waferLINTEC CORP·Filed 1994·Granted Oct 2, 2001·25 cites·13 claims
- 2052US2008260982A1Sheet to Form a Protective Shield for ChipsLINTEC CORP·Filed 2008·Application pending·0 cites
- 2145US7361971B2Semiconductor wafer protection structure and laminated protective sheet for use thereinLINTEC CORP·Filed 2003·Granted Apr 22, 2008·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →