US2008260982A1PendingUtilityA1

Sheet to Form a Protective Shield for Chips

Assignee: LINTEC CORPPriority: Mar 21, 2001Filed: Jun 24, 2008Published: Oct 23, 2008
Est. expiryMar 21, 2021(expired)· nominal 20-yr term from priority
Y10T428/14H10W 74/00H10W 72/07338H10W 72/073H10W 72/354H10W 72/01331H10P 72/7416H10P 72/7402H10P 54/00H10W 74/47H10W 42/121H10W 74/144H10W 72/00
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Claims

Abstract

A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder polymer component.

Claims

exact text as granted — not AI-modified
1 . A sheet to form a protective film for chips comprising a release sheet and a protective film forming layer formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises an energy ray-curable component and a binder polymer component. 
     
     
         2 . The sheet to form a protective film for chips according to  claim 1 , wherein the binder polymer component is composed of an acrylic polymer. 
     
     
         3 . The sheet to form a protective film for chips according to  claim 1 , wherein the energy ray-curable component is composed of an ultraviolet ray-curable resin. 
     
     
         4 . A sheet to form a protective film for chips comprising a release sheet and a protective film forming layer formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises a thermosetting component, an energy ray-curable component and a binder polymer component. 
     
     
         5 . The sheet to form a protective film for chips according to  claim 4 , wherein the binder polymer component is composed of an acrylic polymer. 
     
     
         6 . The sheet to form a protective film for chips according to  claim 4 , wherein the energy ray-curable component is composed of an ultraviolet ray-curable resin.

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