US2008260982A1PendingUtilityA1
Sheet to Form a Protective Shield for Chips
Est. expiryMar 21, 2021(expired)· nominal 20-yr term from priority
Y10T428/14H10W 74/00H10W 72/07338H10W 72/073H10W 72/354H10W 72/01331H10P 72/7416H10P 72/7402H10P 54/00H10W 74/47H10W 42/121H10W 74/144H10W 72/00
52
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder polymer component.
Claims
exact text as granted — not AI-modified1 . A sheet to form a protective film for chips comprising a release sheet and a protective film forming layer formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises an energy ray-curable component and a binder polymer component.
2 . The sheet to form a protective film for chips according to claim 1 , wherein the binder polymer component is composed of an acrylic polymer.
3 . The sheet to form a protective film for chips according to claim 1 , wherein the energy ray-curable component is composed of an ultraviolet ray-curable resin.
4 . A sheet to form a protective film for chips comprising a release sheet and a protective film forming layer formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises a thermosetting component, an energy ray-curable component and a binder polymer component.
5 . The sheet to form a protective film for chips according to claim 4 , wherein the binder polymer component is composed of an acrylic polymer.
6 . The sheet to form a protective film for chips according to claim 4 , wherein the energy ray-curable component is composed of an ultraviolet ray-curable resin.Join the waitlist — get patent alerts
Track US2008260982A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.