Inventor · disambiguated record
Katsuaki Suganuma
Also filed as: SUGANUMA KATSUAKI
32 granted patents·8 pending applications·231 citations·filing 1990–2024
95Inventor score
Top patents by PatentIndex Score
40 records- 0196US6319461B1Lead-free solder alloyNIPPON SHEET GLASS CO LTD·Filed 2001·Granted Nov 20, 2001·60 cites·17 claims
- 0289US6793990B1Method of manufacturing glass panel and glasspanel manufactured by the methodNIPPON SHEET GLASS CO LTD·Filed 2000·Granted Sep 21, 2004·47 cites·26 claims
- 0385US9236162B2Transparent conductive ink and transparent conductive pattern forming methodUNIV OSAKA·Filed 2013·Granted Jan 12, 2016·7 cites·10 claims
- 0483US5965193AProcess for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic materialDOWA MINING CO·Filed 1997·Granted Oct 12, 1999·68 cites·22 claims
- 0579US10201852B2Silver particle synthesizing method, silver particles, conductive paste producing method, and conductive pasteUNIV OSAKA·Filed 2015·Granted Feb 12, 2019·2 cites·10 claims
- 0678US7683195B2Silver β-ketocarboxylate, material comprising the same for forming silver metal, and use thereofOSAKA IND PROMOTIONAL ORGANIZA·Filed 2006·Granted Mar 23, 2010·10 cites·23 claims
- 0776US11652197B2Method for producing an electronic deviceNICHIA CORP·Filed 2021·Granted May 16, 2023·0 cites·13 claims
- 0876US8968608B2Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting deviceKURAMOTO MASAFUMI·Filed 2009·Granted Mar 3, 2015·4 cites·24 claims
- 0975US10099291B2Method for producing metal nanowires and silver nanowiresSHOWA DENKO KK·Filed 2014·Granted Oct 16, 2018·2 cites·15 claims
- 1075US9157004B2Composition for forming copper pattern and method for forming copper patternNOF CORP·Filed 2012·Granted Oct 13, 2015·2 cites·4 claims
- 1173US11217359B2Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction partSENJU METAL INDUSTRY CO·Filed 2018·Granted Jan 4, 2022·0 cites·2 claims
- 1272US12119131B2Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction partSENJU METAL INDUSTRY CO·Filed 2021·Granted Oct 15, 2024·0 cites·9 claims
- 1372US10950770B2Method for producing an electronic deviceNICHIA CORP·Filed 2019·Granted Mar 16, 2021·0 cites·15 claims
- 1466US10573795B2Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting deviceNICHIA CORP·Filed 2017·Granted Feb 25, 2020·0 cites·14 claims
- 1566US9620286B2Insulating material, passive element, circuit board, and method of manufacturing an insulating sheetNIPPON MEKTRON KK·Filed 2014·Granted Apr 11, 2017·1 cites·18 claims
- 1663US11331759B2Solder alloy for power devices and solder joint having a high current densitySENJU METAL INDUSTRY CO·Filed 2020·Granted May 17, 2022·0 cites·12 claims
- 1759US12134146B2Bonding member, method for producing bonding member and method for producing bonding structureUNIV OSAKA·Filed 2022·Granted Nov 5, 2024·0 cites·7 claims
- 1859US11273525B2Bonding material, method for producing bonding material, and method for producing bonding structureUNIV OSAKA·Filed 2017·Granted Mar 15, 2022·0 cites·14 claims
- 1959US6183875B1Electronic circuit substrates fabricated from an aluminum ceramic composite materialDOWA MINING CO·Filed 1998·Granted Feb 6, 2001·21 cites·20 claims
- 2056US2024278321A1Sintered material, metal sintered compact, method for producing sintered material, method for producing joined body, and joined bodyTOPPAN HOLDINGS INC·Filed 2024·Application pending·0 cites
- 2155US9812624B2Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting deviceNICHIA CORP·Filed 2015·Granted Nov 7, 2017·0 cites·21 claims
- 2254US10651143B2Conductive paste having dilatancy, electrode connection structure including the paste, and method for producing the structureSHARP KK·Filed 2017·Granted May 12, 2020·0 cites·3 claims
- 2354US10332853B2Bonding structure and method for producing bonding structureUNIV OSAKA·Filed 2015·Granted Jun 25, 2019·1 cites·18 claims
- 2452US11454601B2Substrate evaluation chip and substrate evaluation deviceUNIV OSAKA·Filed 2020·Granted Sep 27, 2022·0 cites·9 claims
- 2549US2015103269A1Transparent conductive substrate production method, transparent conductive substrate, and electrostatic capacitance touch panelUNIV OSAKA·Filed 2013·Application pending·0 cites
- 2646US10875097B2Silver particle producing method, silver particles, and silver pasteUNIV OSAKA·Filed 2016·Granted Dec 29, 2020·0 cites·13 claims
- 2746US2014112710A1Solder Alloy for Power Devices and Solder Joint Having a High Current DensityALBRECHT HANS-JURGEN·Filed 2012·Application pending·0 cites
- 2845US12094850B2Bonding structure production method and bonding structureUNIV OSAKA·Filed 2020·Granted Sep 17, 2024·0 cites·11 claims
- 2945US8821708B2Method of surface treatment for the inhibition of whiskersTSUJIMOTO MASANOBU·Filed 2006·Granted Sep 2, 2014·0 cites·8 claims
- 3044US2015030783A1Method for manufacturing transparent conductive patternSHOWA DENKO KK·Filed 2013·Application pending·0 cites
- 3143US2007235503A1Solder alloy and soldering methodMITSUBISHI ELECTRIC CORP·Filed 2006·Application pending·0 cites
- 3243US2005230667A1Conductive adhesive and circuit using the sameKOMAGATA MICHINORI·Filed 2005·Application pending·0 cites
- 3342US12318838B2Dispersion medium for metal particle sintering, and electroconductive pasteDAICEL CORP·Filed 2021·Granted Jun 3, 2025·0 cites·18 claims
- 3442US10625344B2Method for producing copper particles, copper particles, and copper pasteUNIV OSAKA·Filed 2016·Granted Apr 21, 2020·0 cites·8 claims
- 3541US9011728B2Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting deviceKURAMOTO MASAFUMI·Filed 2010·Granted Apr 21, 2015·0 cites·18 claims
- 3636US9217192B2Semiconductor device and bonding material for semiconductor deviceSUGANUMA KATSUAKI·Filed 2011·Granted Dec 22, 2015·0 cites·8 claims
- 3736US2020039007A1Bonding member, method for producing bonding member and method for producing bonding structureUNIV OSAKA·Filed 2018·Application pending·0 cites
- 3836US2003007885A1Lead-free solderFiled 2002·Application pending·0 cites
- 3933US5024902AFiber-reinforced metalSHIMADZU CORP·Filed 1990·Granted Jun 18, 1991·6 cites·5 claims
- 4032US11049840B2Bonding deviceUNIV OSAKA·Filed 2017·Granted Jun 29, 2021·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →