Bonding member, method for producing bonding member and method for producing bonding structure

Abstract

A bonding member (10) includes surface-processed silver surfaces (11a, 11b).

1 . A bonding member that bonds a first bonding target and a second bonding target together through heating, comprising a surface-processed silver surface, wherein
 the surface-processed silver surface is ground.   
     
     
         2 . The bonding member of  claim 1 , wherein
 the silver surface is supplied with a compressive stress.   
     
     
         3 . The bonding member of  claim 1 , wherein
 there are 10 or more grain boundaries, between silver grains, per micrometer at the silver surface.   
     
     
         4 . The bonding member of  claim 1 , wherein
 the silver grains each have a size of 1 μm or shorter at the silver surface.   
     
     
         5 . The bonding member of  claim 1 , wherein
 the bonding member has a thickness of 50 μm or greater and 300 μm of less.   
     
     
         6 . (canceled) 
     
     
         7 . (canceled) 
     
     
         8 . The bonding member of  claim 1 , wherein
 the silver surface is a part of a surface of a surface-processed porous silver sheet.   
     
     
         9 . A method for producing a bonding member that bonds a first bonding target and a second bonding target together through heating, comprising:
 preparing a silver layer; and   processing a surface of the silver layer, wherein   in the processing the surface of the silver layer, the surface of the silver layer is ground to process the surface of the silver layer.   
     
     
         10 . (canceled) 
     
     
         11 . (canceled) 
     
     
         12 . The method for producing the bonding member of  claim 9 , wherein
 in the processing of the surface of the silver layer, the surface of the silver layer is processed such that the number of grain boundaries, between silver grains, at the surface of the silver layer is larger than that in a pre-processing state.   
     
     
         13 . The method for producing the bonding member of  claim 9 , wherein
 the silver layer is a porous silver sheet including pores.   
     
     
         14 . The method for producing the bonding member of  claim 13 , wherein
 in the processing of the surface of the silver layer, the surface of the silver layer is processed such that the number of the pores at the surface of the silver layer is smaller than that in a pre-processing state.   
     
     
         15 . A method for producing a bonding structure, comprising:
 preparing a first bonding target, a second bonding target, and a bonding member;   forming a stack body including the first bonding target, the bonding member, and the second bonding target stacked such that the bonding member is located between the first bonding target and the second bonding target; and   heating the stack body to bond the first bonding target and the second bonding target to each other via the bonding member,   wherein in the preparing of the bonding member, the bonding member includes a surface-processed silver surface, and   the surface-processed silver surface is ground.   
     
     
         16 . The method for producing the bonding structure of  claim 15 , wherein
 in the preparing of the first bonding target, the second bonding target, and the bonding member, the bonding member is separate from the first bonding target and the second bonding target.   
     
     
         17 . The method for producing the bonding structure of  claim 15 , wherein
 in the preparing of the first bonding target, the second bonding target, and the bonding member, the bonding member is formed in advance on at least one of the first bonding target and the second bonding target.   
     
     
         18 . The method for producing the bonding structure of  claim 15 , wherein
 in the bonding of the first bonding target and the second bonding target, the stack body is heated at a temperature of 150° C. or higher and 350° C. or lower.