Inventor · disambiguated record
Brian Taggart
Also filed as: TAGGART BRIAN · TAGGART BRIAN C · TAGGART BRIAN F · TAGGART BRIAN FRANKLIN
14 granted patents·11 pending applications·273 citations·filing 1999–2015
93Inventor score
Top patents by PatentIndex Score
25 records- 0191US7304373B2Power distribution within a folded flex package method and apparatusINTEL CORP·Filed 2004·Granted Dec 4, 2007·83 cites·18 claims
- 0290US8463508B2Implement angle correction system and associated loaderNICHOLSON CHRISTIAN·Filed 2009·Granted Jun 11, 2013·28 cites·20 claims
- 0386US7358444B2Folded substrate with interposer package for integrated circuit devicesINTEL CORP·Filed 2004·Granted Apr 15, 2008·34 cites·21 claims
- 0478US7372133B2Microelectronic package having a stiffening element and method of making sameINTEL CORP·Filed 2005·Granted May 13, 2008·9 cites·15 claims
- 0578US6314727B1Method and apparatus for controlling an electro-hydraulic fluid systemCATERPILLAR INC·Filed 1999·Granted Nov 13, 2001·46 cites·43 claims
- 0676US8960227B2Hydraulic fluid tankSMITH SAGE FREDERICK·Filed 2012·Granted Feb 24, 2015·5 cites·20 claims
- 0775US7375978B2Method and apparatus for trace shielding and routing on a substrateINTEL CORP·Filed 2003·Granted May 20, 2008·23 cites·17 claims
- 0873US9533661B1Simulated EH braking system and safety protectionCATERPILLAR INC·Filed 2015·Granted Jan 3, 2017·2 cites·20 claims
- 0972US7190068B2Bottom heat spreaderINTEL CORP·Filed 2004·Granted Mar 13, 2007·19 cites·26 claims
- 1071US8612103B2Implement angle correction system and associated loaderCATERPILLAR INC·Filed 2013·Granted Dec 17, 2013·4 cites·20 claims
- 1168US7250684B2Circular wire-bond pad, package made therewith, and method of assembling sameINTEL CORP·Filed 2004·Granted Jul 31, 2007·14 cites·4 claims
- 1258US2009272745A1Disposable Substance Dispensing ApparatusDOHSE RYAN·Filed 2008·Application pending·0 cites
- 1355US7780058B2Braided solderYAO SIUYOUNG·Filed 2008·Granted Aug 24, 2010·4 cites·6 claims
- 1448US2008023820A1Bond finger on via substrate, process of making same, package made thereby, and method of assembling sameINTEL CORP·Filed 2007·Application pending·0 cites
- 1547US7818878B2Integrated circuit device mounting with folded substrate and interposerINTEL CORP·Filed 2008·Granted Oct 26, 2010·0 cites·9 claims
- 1647US2008014436A1Circular wire-bond pad, package made therewith, and method of assembling sameINTEL CORP·Filed 2007·Application pending·0 cites
- 1746US2006123096A1Method and Apparatus for Remote Site Access of a Multi-Core Processor Computing SystemTAGGART BRIAN C·Filed 2004·Application pending·0 cites
- 1845US7302756B2Bond finger on via substrate, process of making same, package made thereby, and method of assembling sameINTEL CORP·Filed 2003·Granted Dec 4, 2007·2 cites·10 claims
- 1939US2006202057A1Fertilizer Distribution ApparatusTAGGART BRIAN C·Filed 2005·Application pending·0 cites
- 2037US2006289981A1Packaging logic and memory integrated circuitsNICKERSON ROBERT M·Filed 2005·Application pending·0 cites
- 2135US2005214978A1Lower profile flexible substrate package for electronic componentsTAGGART BRIAN·Filed 2004·Application pending·0 cites
- 2235US2005230850A1Microelectronic assembly having a redistribution conductor over a microelectronic dieTAGGART BRIAN C·Filed 2004·Application pending·0 cites
- 2335US2006001180A1In-line wire bonding on a package, and method of assembling sameTAGGART BRIAN·Filed 2004·Application pending·0 cites
- 2435US2006033217A1Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling sameTAGGART BRIAN·Filed 2004·Application pending·0 cites
- 2534US2013226415A1Continuously Productive Machine During Hydraulic System Overheat ConditionSMITH SAGE FREDERICK·Filed 2012·Application pending·0 cites
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