Assignee
TAGGART BRIAN
0 granted patents·3 pending applications·0 citations·filing 2004–2004
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0135US2005214978A1Lower profile flexible substrate package for electronic componentsTAGGART BRIAN·Filed 2004·Application pending·0 cites
- 0235US2006001180A1In-line wire bonding on a package, and method of assembling sameTAGGART BRIAN·Filed 2004·Application pending·0 cites
- 0335US2006033217A1Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling sameTAGGART BRIAN·Filed 2004·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →