Circular wire-bond pad, package made therewith, and method of assembling same

Abstract

A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also disclosed that is located directly above the via in the substrate. A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is includes a chip stack with a total die-side characteristic dimension, and a total substrate-side characteristic dimension that is smaller than the total die-side characteristic dimension. A computing system includes the curvilinear wire-bond pad.

1 . A process comprising: 
 reverse wire-bonding a mounting substrate to a die, wherein reverse wire-bonding originates on the mounting substrate at a reverse wire-bonding first ball.    
     
     
         2 . The process of  claim 1 , wherein reverse wire-bonding originates on the mounting substrate at a first wire-bond pad that contacts the reverse wire-bonding first ball, and wherein the first wire-bond pad includes a curvilinear footprint.  
     
     
         3 . The process of  claim 1 , wherein reverse wire-bonding originates on the mounting substrate at a first wire-bond pad that contacts the reverse wire-bonding first ball, and wherein the first wire-bond pad includes a footprint selected from a curvilinear footprint, a circular footprint, a rectilinear footprint, and combinations thereof.  
     
     
         4 . The process of  claim 1 , wherein reverse wire-bonding originates on the mounting substrate at a first wire-bond pad that contacts the reverse wire-bonding first ball and at a second wire-bond pad that contacts a reverse wire-bonding second ball, and wherein the first wire-bond pad and the second wire-bond pad are coupled respectively to the die by a wire-bonding scheme.  
     
     
         5 . The process of  claim 1 , wherein reverse wire-bonding originates on the mounting substrate at a first wire-bond pad that contacts the reverse wire-bonding first ball, and at a second wire-bond pad that contacts a reverse wire-bonding second ball, and wherein the first wire-bond pad and the second wire-bond pad are coupled respectively to the die by a staggered wire-bond pad scheme with respect to the die.  
     
     
         6 . The process of  claim 1 , wherein reverse wire-bonding originates on the mounting substrate at a first wire-bond pad that contacts the reverse wire-bonding first ball, and at a second wire-bond pad that contacts a reverse wire-bonding second ball, wherein the first wire-bond pad and the second bond finger are coupled to the die by a wire-bonding scheme, wherein the first wire-bond pad includes a first footprint, where the reverse wire-bonding ball includes a second footprint, and wherein the second footprint is about 67% or less of the first footprint.  
     
     
         7 . The process of  claim 1 , wherein reverse wire-bonding originates on the mounting substrate at a first wire-bond pad that contacts the reverse wire-bonding first ball, and at a second wire-bond pad that contacts a reverse wire-bonding second ball, wherein the first wire-bond pad and the second wire-bond pad are coupled to the die by a staggered wire-bonding scheme with respect to an edge of the die, wherein the first wire-bond pad includes a first footprint, where the reverse wire-bonding ball includes a second footprint, and wherein the second footprint is about 67% or less of the first footprint.  
     
     
         8 . The article of  claim 1 , further including: 
 a first die disposed on the mounting substrate;    a second wire-bond pad, and wherein the first wire-bond pad and the second wire-bond pad are coupled to the first die by a staggered wire-bonding scheme.    
     
     
         9 . An article comprising: 
 a mounting substrate;    a curvilinear wire-bond pad disposed on the mounting substrate; and    a via disposed in the mounting substrate, wherein the via is disposed directly below the curvilinear wire-bond pad.    
     
     
         10 . The article of  claim 9 , wherein the curvilinear wire-bond pad includes an eccentricity in a range from about 0.3 to about 1.  
     
     
         11 . The article of  claim 9 , wherein the curvilinear wire-bond pad includes elements selected from circular, rectilinear, and combinations thereof.  
     
     
         12 . The article of  claim 9 , further including: 
 a die disposed on the mounting substrate, wherein the wire-bond pad includes a first wire-bond pad and a second wire-bond pad, and wherein the first wire-bond pad and the second wire-bond pad are coupled respectively to the die by a staggered wire-bonding scheme with respect to the die and the footprints of the first wire-bond pad and the second wire-bond pad.    
     
     
         13 . A method comprising: 
 forming a first via in a wire-bonding mounting substrate, wherein the wire-bonding mounting substrate includes a first surface and a second surface, and wherein forming proceeds from the second surface toward the first surface;    patterning a first curvilinear wire-bond pad directly over the first via; and    coupling a die to the first curvilinear wire-bond pad.    
     
     
         14 . The method of  claim 13 , wherein coupling the die to the first curvilinear wire-bond pad includes reverse wire bonding.  
     
     
         15 . The method of  claim 13 , further including: 
 disposing a second die above the first die; and    coupling the second die to the mounting substrate by wire bonding the second die to a curvilinear second wire-bond pad.    
     
     
         16 . The article of  claim 9 , further including a wire-bonding ball disposed on the curvilinear wire-bond pad, wherein the curvilinear wire-bond pad includes a first surface area, wherein the wire-bonding ball projects a second area onto the curvilinear wire-bond pad, and wherein the second area is about 67% of the first surface area.  
     
     
         17 . An article comprising: 
 a mounting substrate;    a curvilinear wire-bond pad disposed on the mounting substrate;    a via disposed in the mounting substrate, wherein the via is disposed directly below the curvilinear wire-bond pad;    a die disposed on the mounting substrate, wherein the wire-bond pad includes a first wire-bond pad and a second wire-bond pad, and wherein the first wire-bond pad and the second wire-bond pad are coupled respectively to the die by a staggered wire-bonding scheme with respect to the die and the footprints of the first wire-bond pad and the second wire-bond pad; and    a trace disposed between two adjacent wire-bond pads on the mounting substrate.    
     
     
         18 . The article of  claim 17 , wherein the curvilinear wire-bond pad includes an eccentricity in a range from about 0.3 to about 1.  
     
     
         19 . The article of  claim 17 , wherein the curvilinear wire-bond pad includes elements selected from circular, rectilinear, and combinations thereof.  
     
     
         20 . The article of  claim 17 , further including a wire-bonding ball disposed on the curvilinear wire-bond pad, wherein the curvilinear wire-bond pad includes a first surface area, wherein the wire-bonding ball projects a second area onto the curvilinear wire-bond pad, and wherein the second area is about 67% of the first surface area.