Inventor · disambiguated record
Ryoji Matsushima
Also filed as: MATSUSHIMA RYOJI
15 granted patents·4 pending applications·93 citations·filing 2006–2021
89Inventor score
Top patents by PatentIndex Score
19 records- 0195US7763964B2Semiconductor device and semiconductor module using the sameTOSHIBA KK·Filed 2008·Granted Jul 27, 2010·58 cites·20 claims
- 0287US7911045B2Semiconductor element and semiconductor deviceTOSHIBA KK·Filed 2008·Granted Mar 22, 2011·17 cites·9 claims
- 0382US7755175B2Multi-stack chip package with wired bonded chipsTOSHIBA KK·Filed 2006·Granted Jul 13, 2010·10 cites·12 claims
- 0466US11114322B2Mold and transfer molding apparatusTOSHIBA MEMORY CORP·Filed 2017·Granted Sep 7, 2021·1 cites·7 claims
- 0566US7569921B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2006·Granted Aug 4, 2009·5 cites·19 claims
- 0665US10262879B2Mold deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Apr 16, 2019·1 cites·13 claims
- 0760US11605548B2Transfer molding method with sensor and shut-off pinKIOXIA CORP·Filed 2021·Granted Mar 14, 2023·0 cites·7 claims
- 0857US7968993B2Stacked semiconductor device and semiconductor memory deviceTOSHIBA KK·Filed 2008·Granted Jun 28, 2011·1 cites·20 claims
- 0953US8603865B2Semiconductor storage device and manufacturing method thereofTOSHIBA KK·Filed 2013·Granted Dec 10, 2013·0 cites·2 claims
- 1049US8492885B2Semiconductor storage device and manufacturing method thereofMATSUSHIMA RYOJI·Filed 2012·Granted Jul 23, 2013·0 cites·4 claims
- 1146US8269325B2Semiconductor storage device and manufacturing method thereofMATSUSHIMA RYOJI·Filed 2011·Granted Sep 18, 2012·0 cites·8 claims
- 1244US2010255637A1Stack-type semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2010·Application pending·0 cites
- 1343US2009032972A1Semiconductor deviceTOSHIBA KK·Filed 2008·Application pending·0 cites
- 1442US7598604B2Low profile semiconductor packageTOSHIBA KK·Filed 2006·Granted Oct 6, 2009·0 cites·16 claims
- 1541US9997484B2Semiconductor device and manufacturing method of the sameTOSHIBA MEMORY CORP·Filed 2016·Granted Jun 12, 2018·0 cites·16 claims
- 1639US8749031B2Semiconductor device, method for manufacturing same, and semiconductor apparatusMATSUSHIMA RYOJI·Filed 2011·Granted Jun 10, 2014·0 cites·11 claims
- 1739US2007023875A1Semiconductor package and manufacturing method thereofTOSHIBA KK·Filed 2006·Application pending·0 cites
- 1838US2007023922A1Semiconductor packageTOSHIBA KK·Filed 2006·Application pending·0 cites
- 1932US10896825B2MoldTOSHIBA MEMORY CORP·Filed 2017·Granted Jan 19, 2021·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →