Inventor · disambiguated record
Hsin-Hsien Lu
Also filed as: LU HSIN-HSIEN
30 granted patents·5 pending applications·272 citations·filing 2002–2023
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD21TAIWAN SEMICONDUCTOR MFG11FUJIFILM ELECTRONIC MAT USA INC1WU YUNG-HSU1YANG KU-FENG1
Top patents by PatentIndex Score
35 records- 0193US8828875B1Method and apparatus for improving CMP planarityTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 9, 2014·13 cites·20 claims
- 0293US6677251B1Method for forming a hydrophilic surface on low-k dielectric insulating layers for improved adhesionTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jan 13, 2004·108 cites·20 claims
- 0392US9415479B2Conductive chemical mechanical planarization polishing padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·10 cites·20 claims
- 0492US6962869B1SiOCH low k surface protection layer formation by CxHy gas plasma treatmentTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 8, 2005·77 cites·26 claims
- 0584US8921150B2Process to achieve contact protrusion for single damascene viaTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Dec 30, 2014·8 cites·20 claims
- 0682US9597771B2Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 21, 2017·3 cites·20 claims
- 0782US8889544B2Dielectric protection layer as a chemical-mechanical polishing stop layerWU YUNG-HSU·Filed 2011·Granted Nov 18, 2014·8 cites·20 claims
- 0881US8252682B2Method for thinning a waferYANG KU-FENG·Filed 2010·Granted Aug 28, 2012·8 cites·27 claims
- 0978US9576789B2Apparatus, method, and composition for far edge wafer cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 21, 2017·3 cites·20 claims
- 1078US9434047B2Retainer ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Sep 6, 2016·3 cites·20 claims
- 1178US8021566B2Method for pre-conditioning CMP polishing padTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Sep 20, 2011·6 cites·14 claims
- 1276US11694909B2Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 4, 2023·1 cites·20 claims
- 1375US9287127B2Wafer back-side polishing system and method for integrated circuit device manufacturing processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 15, 2016·2 cites·20 claims
- 1474US11458587B2Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 4, 2022·0 cites·20 claims
- 1573US9852899B2Wafer back-side polishing system and method for integrated circuit device manufacturing processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 26, 2017·1 cites·20 claims
- 1673US9601409B2Protruding contact for integrated chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 21, 2017·3 cites·20 claims
- 1772US11705324B2Apparatus and method for wafer cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·19 claims
- 1871US9559021B2Wafer back-side polishing system and method for integrated circuit device manufacturing processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 31, 2017·1 cites·20 claims
- 1970US12495603B2Semiconductor device and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 2067US10504753B2Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 10, 2019·1 cites·20 claims
- 2167US9466501B2Method and apparatus for improving CMP planarityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 11, 2016·1 cites·20 claims
- 2267US6770570B2Method of forming a semiconductor device with a substantially uniform density low-k dielectric layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 3, 2004·13 cites·9 claims
- 2366US11594455B2Semiconductor device and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 2466US10377013B2Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 13, 2019·0 cites·20 claims
- 2564US8348719B2Polisher for chemical mechanical planarizationTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jan 8, 2013·2 cites·23 claims
- 2663US10998184B2Apparatus and method for wafer cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 4, 2021·0 cites·20 claims
- 2761US10734254B2Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 2858US2024174892A1Polishing compositions and methods of use thereofFUJIFILM ELECTRONIC MAT USA INC·Filed 2023·Application pending·0 cites
- 2956US10325772B2Apparatus and method for wafer cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 18, 2019·0 cites·15 claims
- 3050US10770314B2Semiconductor device, tool, and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 8, 2020·0 cites·20 claims
- 3150US2019096703A1Semiconductor Device, Tool, and Method of ManufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Application pending·0 cites
- 3242US2014227945A1Chemical mechanical planarization platenTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
- 3340US7105446B2Apparatus for pre-conditioning CMP polishing padTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 12, 2006·0 cites·7 claims
- 3440US2006112971A1Method of eliminating galvanic corrosion in copper CMPTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 3538US2005170980A1ER cleaning composition and methodTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →